The Week in Review: IoT


Products/Services No matter the size of your button! You can now order up a flight on a private jet with the push of, yes, a button! GrandView Jets, an affiliate of GrandView Aviation, is bringing out a Web-enabled “Press for Jet” button, an Amazon Web Services Internet of Things button enabled by ButtonJoy Software. GrandView Jets says it has a fleet of Embraer Phenom 300 private jets to ... » read more

The Week in Review: IoT


Investment The city of Dresden, Germany, is touting its prospects as a tech hub in the “Silicon Saxony” ecosystem, particularly for Internet of Things technology. Bosch, the German Aerospace Center, GlobalFoundries, Infineon Technologies, and other organizations are planning to invest about €4.5 billion (approximately $5.3 billion) over several years to develop processors, sensors, and 5... » read more

Ethernet’s Next Life


An ever-growing engagement with the Internet — where most of humanity and the ‘things’ we use are almost constantly connected and constantly storing, processing and retrieving data over a network — is increasing pressure to develop new standards, and much more quickly. Witness the timeline of Ethernet, and its humble beginnings as a standard protocol for moving data at 2.5 megabits p... » read more

5 Takeaways From SEMI’s SMC


At the recent Strategic Materials Conference (SMC), there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the IC industry, market drivers, electronic materials and other subjects. In no particular order, here are my five takeaways from SMC: Materials M&A mania Last year, the IC industry experienced a dizzying array of merger ... » read more

The Week In Review: IoT


Conferences Artificial intelligence, the Internet of Things, and 5G wireless communications were the talk of this week’s Mobile World Congress Americas event at the Moscone Center in San Francisco. Interesting topics, to be sure, yet they were eclipsed by a panel discussion on Wednesday afternoon about a matter of life or death. At a program put together by 151 Advisors, one of the panel ses... » read more

Executive Insight: Wally Rhines


Wally Rhines, president and CEO of [getentity id="22017" e_name="Mentor, a Siemens Business"], sat down with Semiconductor Engineering to talk about industry consolidation, a shift in emphasis from chips to systems, and what the recent acquisition by Siemens will mean for Mentor. What follows are excerpts of that conversation. SE: A year ago it looked as if the entire industry was going to b... » read more

The Week In Review: IoT


Finance Particle, the provider of a full-stack Internet of Things device platform for enterprises, has raised $20 million in Series B funding, bringing its total venture funding to $30 million. Spark Capital led the new round, with participation by Qualcomm Ventures and existing investors in the IoT startup. Machina Research estimates cellular IoT connections will increase from 334 million in ... » read more

The Week In Review: IoT


Analysis Adam Greenfield writes about the privacy and technology issues raised by the Internet of Things in this piece, an adapted extract from his new book, "Radical Technologies: The Design of Everyday Life." “The Internet of Things presents many new possibilities, and it would be foolish to dismiss those possibilities out of hand. But we would also be wise to approach the entire domain wi... » read more

The Week In Review: IoT


Analysis Whither Intel’s Internet of Things efforts? “While Intel's IoT business certainly won't solve its ongoing troubles in the PC and data center markets anytime soon, staying invested in that market will ensure that the chipmaker doesn't miss another major technological shift, as it did with mobile devices about a decade ago,” Leo Sun writes in this analysis. Products Cisco Sys... » read more

Huawei Delivers Outstandingly Accurate Models


By John Parry, Mentor, a Siemens Business, and Yake Fang, Huawei Technologies Co., Ltd. Packaging high-performance multi-core IC devices used in communication applications is a key challenge for both manufacturers and system integrators. Traditionally a System-in-Package (SiP) has been taken, with chips mounted side-by-side, allowing differing semiconductor technologies to be mixed. More r... » read more

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