tag: Huawei

Ethernet’s Next Life
By Gale Morrison - 05 Oct, 2017 - Comments: 0

An ever-growing engagement with the Internet — where most of humanity and the ‘things’ we use are almost constantly connected and constantly storing, processing and retrieving data over a network — is increasing pressure to develop new standards, and much more quickly. Witness the timeline of Ethernet, and its humble beginnings as a standard protocol for moving data at 2.5 megabits p... » read more

5 Takeaways From SEMI’s SMC
By Mark LaPedus - 21 Sep, 2017 - Comments: 0

At the recent Strategic Materials Conference (SMC), there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the IC industry, market drivers, electronic materials and other subjects. In no particular order, here are my five takeaways from SMC: Materials M&A mania Last year, the IC industry experienced a dizzying array of merger ... » read more

The Week In Review: IoT
By Jeff Dorsch - 15 Sep, 2017 - Comments: 0

Conferences Artificial intelligence, the Internet of Things, and 5G wireless communications were the talk of this week’s Mobile World Congress Americas event at the Moscone Center in San Francisco. Interesting topics, to be sure, yet they were eclipsed by a panel discussion on Wednesday afternoon about a matter of life or death. At a program put together by 151 Advisors, one of the panel ses... » read more

Executive Insight: Wally Rhines
By Ed Sperling - 31 Aug, 2017 - Comments: 2

Wally Rhines, president and CEO of [getentity id="22017" e_name="Mentor, a Siemens Business"], sat down with Semiconductor Engineering to talk about industry consolidation, a shift in emphasis from chips to systems, and what the recent acquisition by Siemens will mean for Mentor. What follows are excerpts of that conversation. SE: A year ago it looked as if the entire industry was going to b... » read more

The Week In Review: IoT
By Jeff Dorsch - 21 Jul, 2017 - Comments: 0

Finance Particle, the provider of a full-stack Internet of Things device platform for enterprises, has raised $20 million in Series B funding, bringing its total venture funding to $30 million. Spark Capital led the new round, with participation by Qualcomm Ventures and existing investors in the IoT startup. Machina Research estimates cellular IoT connections will increase from 334 million in ... » read more

The Week In Review: IoT
By Jeff Dorsch - 09 Jun, 2017 - Comments: 0

Analysis Adam Greenfield writes about the privacy and technology issues raised by the Internet of Things in this piece, an adapted extract from his new book, "Radical Technologies: The Design of Everyday Life." “The Internet of Things presents many new possibilities, and it would be foolish to dismiss those possibilities out of hand. But we would also be wise to approach the entire domain wi... » read more

The Week In Review: IoT
By Jeff Dorsch - 26 May, 2017 - Comments: 0

Analysis Whither Intel’s Internet of Things efforts? “While Intel's IoT business certainly won't solve its ongoing troubles in the PC and data center markets anytime soon, staying invested in that market will ensure that the chipmaker doesn't miss another major technological shift, as it did with mobile devices about a decade ago,” Leo Sun writes in this analysis. Products Cisco Sys... » read more

Huawei Delivers Outstandingly Accurate Models
By John Parry - 25 May, 2017 - Comments: 0

By John Parry, Mentor, a Siemens Business, and Yake Fang, Huawei Technologies Co., Ltd. Packaging high-performance multi-core IC devices used in communication applications is a key challenge for both manufacturers and system integrators. Traditionally a System-in-Package (SiP) has been taken, with chips mounted side-by-side, allowing differing semiconductor technologies to be mixed. More r... » read more

Moore’s Law: Toward SW-Defined Hardware
By Ed Sperling - 15 May, 2017 - Comments: 2

Pushing to the next process node will continue to be a primary driver for some chips—CPUs, FPGAs and some ASICS—but for many applications that approach is becoming less relevant as a metric for progress. Behind this change is a transition from using customized software with generic hardware, to a mix of specialized, heterogeneous hardware that can achieve better performance with less ene... » read more

Advanced Packaging Goes Mainstream
By Ed Sperling - 08 May, 2017 - Comments: 0

The roadmap for shrinking digital logic will continue for at least the next 10 years. For others devices, particularly analog, it will slow down or end. And therein lies one of the most fundamental changes in semiconductor design and manufacturing in the past half century. This is no longer just talk. Apple is using a fan-out architecture in its iPhone 7. Memory makers are stacking NAND and ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy