tag: Huawei

5G & IoT
By Jeff Dorsch - 02 Feb, 2017 - Comments: 0

“Designing to Evolving 4G and Pre-5G Requirements” was the title of a Tuesday morning tutorial at DesignCon 2017 in Santa Clara, Calif. Talk of 5G naturally segued into Internet of Things discussion during the session. Parviz Yegani, a consultant with GHB Intellect, laid out the IoT use cases that could be enhanced by 5G technology: Shopping, population-dense urban areas, remote computin... » read more

China Unveils Memory Plans
By Mark LaPedus - 19 Jan, 2017 - Comments: 2

Backed by billions of dollars in government funding, China in 2014 launched a major initiative to advance its domestic semiconductor, IC-packaging and other electronic sectors. So far, though, the results are mixed. China is making progress in IC-packaging, but the nation’s efforts to advance its domestic logic and memory sectors are still a work in progress. In fact, China has yet to achi... » read more

What’s Missing In Advanced Packaging
By Ann Mutschler - 22 Dec, 2016 - Comments: 0

Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

Changes In China
By SEMI - 21 Nov, 2016 - Comments: 0

By Jesse Zhang, SEMI China Industry leaders gathered in Beijing at BIMS 2016 — the Beijing International Microelectronics Symposium — to discuss growth opportunities for the semiconductor industry and the mobile communications market. The 17th session of BIMS was co-sponsored by SEMI and the Chinese-American Semiconductor Professionals Association (CASPA). For 17 years, BIMS has provi... » read more

Making 2.5D, Fan-Outs Cheaper
By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

Teaching Computers To See
By Ann Mutschler - 16 Nov, 2016 - Comments: 0

Vision processing is emerging as a foundation technology for a number of high-growth applications, spurring a wave of intensive research to reduce power, improve performance, and push embedded vision into the mainstream to leverage economies of scale. What began as a relatively modest development effort has turned into an all-out race for a piece of this market, and for good reason. Mark... » read more

Neural Net Computing Explodes
By Gale Morrison - 06 Oct, 2016 - Comments: 1

Neural networking with advanced parallel processing is beginning to take root in a number of markets ranging from predicting earthquakes and hurricanes to parsing MRI image datasets in order to identify and classify tumors. As this approach gets implemented in more places, it is being customized and parsed in ways that many experts never envisioned. And it is driving new research into how el... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Sep, 2016 - Comments: 0

Chipmakers In 2016, growth in the pure-play foundry business will be driven by leading-edge processes, according to IC Insights. In fact, the increase in pure-play foundry sales this year is forecast to be almost entirely due to processes at » read more

Building Chips That Can Learn
By Ed Sperling - 29 Sep, 2016 - Comments: 0

The idea that devices can learn optimal behavior rather than relying on more generalized hardware and software is driving a resurgence in artificial intelligence, machine leaning, and cognitive computing. But architecting, building and testing these kinds of systems will require broad changes that ultimately could impact the entire semiconductor ecosystem. Many of these changes are wel... » read more

The Week in Review: IoT
By Jeff Dorsch - 22 Jul, 2016 - Comments: 0

Deals The big news of the week, of course, is SoftBank Group’s proposed acquisition of ARM Holdings for a breathtaking $32.2 billion in cash. In announcing the deal, the companies made it abundantly clear that the proposed acquisition is chiefly about Internet of Things technology. “When I think about the investment and the commitment that’s going to be required to develop the future te... » read more

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