tag: Huawei

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Oct, 2020 - Comments: 1

Chipmakers and OEMs AMD is in talks to acquire Xilinx in a deal that could be worth more than $30 billion, according to a report from The Wall Street Journal. If the deal transpires, AMD will enter the FPGA business, putting it further in competition with Intel. No deal has been struck, though. --------------------------------------------- Multiple sources believe that China’s Huawei i... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 25 Sep, 2020 - Comments: 0

Automotive The State of California has banned the selling of new vehicles with gasoline-powered internal combustion engines (ICE) by 2035. All new passenger cars sold in 15 years in California will be zero emission cars, according to an executive order signed by the state’s governor. Older ICE passenger cars will still be allowed on the roads and can still be sold as used vehicles. The order... » read more

DRAM, 3D NAND Face New Challenges
By Mark LaPedus - 21 Sep, 2020 - Comments: 1

It’s been a topsy-turvy period for the memory market, and it's not over. So far in 2020, demand has been slightly better than expected for the two main memory types — 3D NAND and DRAM. But now there is some uncertainty in the market amid a slowdown, inventory issues and an ongoing trade war. In addition, the 3D NAND market is moving toward a new technology generation, but some are enc... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 04 Sep, 2020 - Comments: 0

AI on edge Cadence’s Tensilica Vision P6 DSP IP will be in Kneron’s KL720, a 1.4TOPS AI system-on-chip (SoC) targeted for AI of things (AIoT), smart home, smart surveillance, security, robotics and industrial control applications. Arm announced its Arm Cortex-R82, a 64-bit, Linux-capable Cortex-R processor for enterprise and computational storage systems. The processor is designed to pr... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Aug, 2020 - Comments: 0

Trade As reported, the U.S. recently implemented more restrictions on U.S. chip sales to Huawei. In response, SEMI has released the following statement in response to the new export control rule changes announced by the U.S. Commerce Department: “SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export ... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 28 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Marvell is working on silicon for the data infrastructure market using TSMC’s 5nm process node. Marvell says it has multiple designs already under contract for its 5nm portfolio across the carrier, enterprise, automotive, and data center markets. The first products are sampling by the end of next year.  Ansys’ multiphysics signoff tools, R... » read more

Power Amp Wars Begin For 5G
By Mark LaPedus - 24 Aug, 2020 - Comments: 2

Demand is increasing for power amplifier chips and other RF devices for 5G base stations, setting the stage for a showdown among different companies and technologies. The power amplifier device is a key component that boosts the RF power signals in base stations. It's based on two competitive technologies, silicon-based LDMOS or RF gallium nitride (GaN). GaN, a III-V technology, outperforms ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Aug, 2020 - Comments: 0

Packaging Chunghwa Telecom, ASE and Qualcomm Technologies have announced plans to jointly build Taiwan's first 5G mmWave enterprise private network smart factory. As part of the plan, ASE is deploying a series of smart factory technologies within its existing Kaohsiung, Taiwan-based campus. This includes the deployment of 5G mmWave network cells in the Kaohsiung campus. Qualcomm will be ... » read more

Huawei: 5G Is About Capacity, Not Speed
By Ed Sperling - 18 Aug, 2020 - Comments: 3

Paul Scanlan, CTO of the Huawei Carrier Business Group in Huawei Technologies, sat down with Semiconductor Engineering to talk about 5G, which use cases are attractive and why, and how that compares with previous wireless technologies. SE: Where are you seeing 5G, and how do you see this rolling out both for sub-6GHz and millimeter wave? Scanlan: 5G is a platform for transformation. The f... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Aug, 2020 - Comments: 0

Chipmakers At its Architecture Day this week, Intel disclosed its roadmap for the company’s next-generation microprocessors, graphics chips, FPGAs and other products. As part of the event, Intel announced some new enhancements for its existing 10nm finFET technology. Basically, it’s a mid-life kicker for the technology. Intel calls it the 10nm SuperFin technology, which is a redefinitio... » read more

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