PCM-Based IMC Technology: Overview Of Materials, Device Physics, Design and Fabrication (IBM Research-Europe)


A new technical paper titled "Phase-Change Memory for In-Memory Computing" was published by researchers at IBM Research-Europe. "We review the current state of phase-change materials, PCM device physics, and the design and fabrication of PCM-based IMC chips. We also provide an overview of the application landscape and offer insights into future developments," states the paper. Find the te... » read more

Chip Industry Technical Paper Roundup: June 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=438 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


Qualcomm announced plans to buy Alphawave Semi for ~$2.4 billion in a deal expected to close in Q1 2026. Qualcomm plans to leverage Alphawave Semi's connectivity products, including chiplets, to develop high-performance, low-power solutions for AI inferencing and customized CPUs in data centers. Qualcomm's traditional targets were mobile phones and edge computing. [Updated 6/9.] Global semic... » read more

Customizing An LLM Tailored Specifically For VHDL Code And Design Of High Performance Processors (IBM)


A new technical paper titled "Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors" was published by researchers at IBM. Abstract "The use of Large Language Models (LLMs) in hardware design has taken off in recent years, principally through its incorporation in tools that increase chip designer productivity. There has been considerable discussion about the ... » read more

Chip Industry Technical Paper Roundup: May 28


New technical papers recently added to Semiconductor Engineering’s library: [table id=434 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


Podcast: imec's roadmap and a one-on-one interview with the European research house's chief strategy officer. China's Xiaomi debuted an in-house-designed 10-core mobile SoC built on a 3nm process. The company did not identify the foundry. It also announced plans to invest 50 billion yuan (~$7B) over the next decade to develop high-end smartphone chips, as part of a 200 billion yuan (~$28B) c... » read more

Chip Industry Technical Paper Roundup: May 20


New technical papers recently added to Semiconductor Engineering’s library: [table id=432 /] Find more semiconductor research papers here. » read more

Radiation, Temperature, Power Challenges For Chips In Space


Mission-critical hardware used in space is not supposed to fail at all, because lives may be lost in addition to resources, availability, performance, and budgets. For space applications, failure can occur due to a range of factors, including the weather on the day of launch, human error, environmental conditions, unexpected or unknown hazards and degradation of parts to chemical factors, aging... » read more

Chip Industry Week in Review


Check out the Inside Chips podcast for our behind-the-scenes analysis of changes at Intel Foundry. Intel rolled out its updated process technology roadmap this week, along with early process design kit (PDK) for its 14A gate-all-around process technology. That node will utilize high-NA EUV, and include direct contact power delivery, the second generation of its backside power delivery techno... » read more

Chip Industry Week in Review


To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

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