Week In Review, Manufacturing, Test

By Susan Rambo - 08 Jul, 2022 - Comments: 0

The U.S. is attempting to restrict sales of ASML’s deep ultra-violet (DUV) litho systems to China, according to a report from Bloomberg. The U.S. has been working to limit China's access to advanced technology for some time, and it has already limited sales of extreme ultra-violet (EUV), which is used to develop chips at the most advanced process nodes. DUV, in contrast, is used for older-nod... » read more

Technical Paper Round-Up: June 28

By Linda Christensen - 28 Jun, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=35 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

OTA On-Chip Computing That Conquers A Bottleneck In Wired NoC Architectures

By Technical Paper Link - 21 Jun, 2022 - Comments: 0

New research paper titled "Wireless On-Chip Communications for Scalable In-memory Hyperdimensional Computing" from researchers at IBM Research, Zurich Switzerland and Universitat Politecnica de Catalunya, Barcelona, Spain Abstract: "Hyperdimensional computing (HDC) is an emerging computing paradigm that represents, manipulates, and communicates data using very long random vectors (aka hyp... » read more

Technical Paper Round-up: May 17

By Linda Christensen - 17 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=27 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a go... » read more

ASD process that was performed in situ on the etch chamber

By Technical Paper Link - 06 May, 2022 - Comments: 0

New research paper entitled "Plasma-based area selective deposition for extreme ultraviolet resist defectivity reduction and process window improvement" from TEL Technology Center, Americas and IBM Research. Abstract: "Extreme ultraviolet (EUV) lithography has overcome significant challenges to become an essential enabler to the logic scaling roadmap. However, it remains limited by stocha... » read more

Week In Review: Design, Low Power

By Jesse Allen - 01 Apr, 2022 - Comments: 0

Tools Synopsys introduced a new model for using its EDA tools on the cloud. Synopsys Cloud provides pay-as-you-go access to the company's cloud-optimized design and verification products, with pre-optimized infrastructure on Microsoft Azure to address higher levels of interdependencies in chip development. "As more design flows incorporate AI, requiring even more resources, the virtually unlim... » read more

Toward Software-Equivalent Accuracy on Transformer-Based Deep Neural Networks With Analog Memory Devices

By Technical Paper Link - 20 Dec, 2021 - Comments: 0

Abstract: "Recent advances in deep learning have been driven by ever-increasing model sizes, with networks growing to millions or even billions of parameters. Such enormous models call for fast and energy-efficient hardware accelerators. We study the potential of Analog AI accelerators based on Non-Volatile Memory, in particular Phase Change Memory (PCM), for software-equivalent accurate i... » read more

Enabling Training of Neural Networks on Noisy Hardware

By Technical Paper Link - 18 Nov, 2021 - Comments: 0

Abstract: "Deep neural networks (DNNs) are typically trained using the conventional stochastic gradient descent (SGD) algorithm. However, SGD performs poorly when applied to train networks on non-ideal analog hardware composed of resistive device arrays with non-symmetric conductance modulation characteristics. Recently we proposed a new algorithm, the Tiki-Taka algorithm, that overcomes t... » read more

Accelerating Inference of Convolutional Neural Networks Using In-memory Computing

By Technical Paper Link - 17 Nov, 2021 - Comments: 0

Abstract: "In-memory computing (IMC) is a non-von Neumann paradigm that has recently established itself as a promising approach for energy-efficient, high throughput hardware for deep learning applications. One prominent application of IMC is that of performing matrix-vector multiplication in (1) time complexity by mapping the synaptic weights of a neural-network layer to the devices of a... » read more

Von Neumann Is Struggling

By Brian Bailey - 18 Jan, 2021 - Comments: 5

In an era dominated by machine learning, the von Neumann architecture is struggling to stay relevant. The world has changed from being control-centric to one that is data-centric, pushing processor architectures to evolve. Venture money is flooding into domain-specific architectures (DSA), but traditional processors also are evolving. For many markets, they continue to provide an effective s... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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