tag: IBM

Chip Industry’s Technical Paper Roundup: Jan. 17
By Linda Christensen - 17 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library. [table id=74 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting li... » read more

Arbitrary Precision DNN Accelerator Controlled by a RISC-V CPU (Ecole Polytechnique Montreal, IBM, Mila, CMC)
By Technical Paper Link - 10 Jan, 2023 - Comments: 1

A new technical paper titled "BARVINN: Arbitrary Precision DNN Accelerator Controlled by a RISC-V CPU" was written by researchers at Ecole Polytechnique Montreal, IBM, Mila and CMC Microsystems. It was accepted for publication in the 2023, 28th Asia and South Pacific Design Automation Conference (ASP-DAC 2023) in Japan. Abstract: "We present a DNN accelerator that allows inference at arbitr... » read more

Metrology Options Increase As Device Needs Shift
By Laura Peters - 10 Jan, 2023 - Comments: 1

Semiconductor fabs are taking an ‘all hands on deck’ approach to solving tough metrology and yield management challenges, combining tools, processes, and other technologies as the chip industry transitions to nanosheet transistors on the front end and heterogenous integration on the back end. Optical and e-beam tools are being extended, while X-ray inspection is being added on a case-by-... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 16 Dec, 2022 - Comments: 0

The CHIPS Act sparked $200 billion in private investments for U.S. semiconductor production, including 40 new semiconductor ecosystem projects, according to SIA. China is working toward self-sufficiency, with plans to invest more than 1 trillion yuan ($143 billion) to support domestic semiconductor production, according to Reuters. Arm said that Britain and the U.S. would not approve license... » read more

Chip Industry’s Technical Paper Roundup: Dec. 13
By Linda Christensen - 13 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week.[table id=70 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us po... » read more

HW-Enabled Security Techniques To Improve Platform Security And Data Protection For Cloud Data Centers And Edge Computing (NIST)
By Technical Paper Link - 06 Dec, 2022 - Comments: 0

A technical paper titled "Hardware-Enabled Security: Enabling a Layered Approach to Platform Security for Cloud and Edge Computing Use Cases" was published by NIST, Intel, AMD, Arm, IBM, Cisco and Scarfone Cybersecurity. Abstract: "In today’s cloud data centers and edge computing, attack surfaces have shifted and, in some cases, significantly increased. At the same time, hacking has becom... » read more

Challenges And Solutions In Chip Design
By Marc Swinnen - 21 Nov, 2022 - Comments: 0

Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics. The December 6th on-line event starts with Keynote addresses from Raja Koduri from Intel, Pankaj Kukkal from Qualcomm, and insights into the metaverse from DP Prakash with start-up... » read more

Where All The Semiconductor Investments Are Going
By Ed Sperling - 17 Nov, 2022 - Comments: 2

Companies and countries are funneling huge sums of money into semiconductor manufacturing, materials, and research — at least a half-trillion dollars over the next decade, and maybe much more — to guarantee a steady supply of chips and know-how to support growth across a wide swath of increasingly data-centric industries. The build-out of a duplicate supply chain that can guarantee capac... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 11 Nov, 2022 - Comments: 0

U.S. President Joe Biden appears ready to increase pressure on Japan and the Netherlands to help block the flow of advanced chip technology to China, where it can be used to develop cutting-edge weapons. "You will see Japan and Netherlands follow our lead," U.S. Commerce Secretary Gina Raimondo told CNBC. Japan plans to budget ¥350 billion ($2.38 billion) in a research collaboration with th... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Nov, 2022 - Comments: 0

Chip design Fraunhofer IIS/EAS implemented the Bunch of Wires (BoW) standard-based interface IP from the Open Compute Project (OCP) on Samsung's 5nm technology. The effort is intended to make chiplets more feasible for products with small and medium-sized production runs and determine the need for additional uniform standards in the future, such as for die-to-die bonding. “As part of t... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy