tag: IBM

The Week In Review: Manufacturing
By Mark LaPedus - 09 Dec, 2016 - Comments: 2

Chipmakers At this week’s IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC as well as the team of GlobalFoundries, IBM and Samsung separately presented papers on 7nm finFET technology. Qualcomm has begun sampling the world’s first 10nm server processor. As the first in the Qualcomm Centriq product family, the ARM-based processor has up to 48-cores and is built ... » read more

Manufacturing Bits: Dec. 6
By Mark LaPedus - 06 Dec, 2016 - Comments: 1

The National High Magnetic Field Laboratory (MagLab) has broken an unofficial record for the world’s most powerful hybrid magnet. The 33-ton system, called the series connected hybrid (SCH) magnet, has reached its full field strength of 36 tesla. The SCH is more than 40% stronger than the previous world-record hybrid magnet. Tesla, or T, is the measurement of magnetic field strength. A ref... » read more

The Week In Review: IoT
By Jeff Dorsch - 25 Nov, 2016 - Comments: 0

Analysis The Internet of Things may be entering the infamous “Trough of Disillusionment” in the Gartner Hype Cycle, according to some observers. “There’s a general malaise growing around IoT. Where is this shiny, artificially intelligent, fully connected future of things we were promised?” iobeam CEO Ajay Kulkarni writes in this analysis. Others are more sanguine about the IoT. Clear... » read more

Printed Cars, Smart Stints, Personal Breathalyzers
By Joanne Itow - 21 Nov, 2016 - Comments: 0

The MEMS and sensor market continues to be a hotbed for innovation, new opportunities and, as with most new frontiers, there are also some disparate views on market dynamics and strategies. All this was evident at the 2016 MSIG Executive Congress last week in Scottsdale, Arizona. First, I’ll cover the pioneering and fun subjects. In addition to the Technology Showcase demos and member pres... » read more

Making 2.5D, Fan-Outs Cheaper
By Ed Sperling - 17 Nov, 2016 - Comments: 2

Now that it has been shown to work, the race is on to make advanced [getkc id="27" kc_name="packaging"] more affordable. While device scaling could continue for another decade or more, the number of companies that can afford to develop SoCs at the leading edge will continue to decline. The question now being addressed is what can supplant it, supplement it, or redefine it. At the center o... » read more

Gaps In The Verification Flow
By Brian Bailey - 01 Nov, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the state of the functional verification flow with Stephen Bailey, director of emerging companies at [getentity id="22017" e_name="Mentor Graphics"]; [getperson id="11079" comment="Anupam Bakshi"], CEO of [getentity id="22168" e_name="Agnisys"]; [getperson id="11124" comment="Mike Bartley"], CEO of [getentity id="22868" e_name="Test and Verification... » read more

The Battle To Embed The FPGA
By Brian Bailey - 31 Oct, 2016 - Comments: 1

There have been many attempts to embed an [gettech id="31071" comment="FPGA"] into chips in the past, but the market has failed to materialize—or the solutions have failed to inspire. An early example was [getentity id="22924" comment="Triscend"], founded in 1997 and acquired by [getentity id="22839" e_name="Xilinx"] in 2004. It integrated a CPU—which varied from an [getentity id="22186" co... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 21 Oct, 2016 - Comments: 1

Chipmakers At upcoming the 2016 IEEE International Electron Devices Meeting (IEDM) in San Francisco, TSMC will square off against the alliance of IBM, GlobalFoundries and Samsung at 7nm. IEDM will take place Dec. 3-7, 2016. TSMC will present a paper on 7nm finFET technology. Using 193nm immersion and multi-patterning, the 7nm technology features more than three times the gate density and ei... » read more

10nm FinFET Market Heats Up
By Mark LaPedus - 16 Oct, 2016 - Comments: 1

The 10nm finFET market is heating up in the foundry business amid the ongoing push to develop chips at advanced nodes. Not long ago, Intel announced its 10nm finFET process, with plans to ramp up the technology in 2017. Then, TSMC recently introduced its 10nm process, with plans to move into production by the fourth quarter of 2016. Now, Samsung Electronics said that it has commenced mass... » read more

Where Are The IoT Industry Standards?
By Jeff Dorsch - 10 Oct, 2016 - Comments: 0

Are you ready for some Internet of Things standards? Good, because you can help make them. The IoT is proceeding apace as a business, eagerly embraced by such corporate behemoths as Cisco Systems, General Electric, IBM, and Verizon Communications. What’s lacking is the codification of industry standards for the IoT, as many companies have aligned with groups that have competing agendas and... » read more

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