The Week In Review: Manufacturing


IBM’s move to sell its chip business to GlobalFoundries may have stalled or is dead, according to the Albany Times Union and other news outlets. New York Governor Andrew Cuomo announced that the state will partner with over 100 private companies, led by GE, to launch the New York Power Electronics Manufacturing Consortium. GE will be a lead partner in a fab, housed at the CNSE Nano Tech co... » read more

Blog Review: July 16


Mentor’s Scott Salzwedel describes a conversation that could very well happen in the future and it raises an interesting idea. As medical electronics proliferate, will emergency medical teams need to include out systems engineers? Cadence’s Brian Fuller has a summer engineering project that resembles the Bridge Over the River Kwai. He should win an Oscar for this one. Ansys’ Bill ... » read more

GPUs Dominate (Again) The Green500 List


The Green500 has released its latest list of the top 500 most energy-efficient Supercomputers. The top 17 are heterogeneous systems (systems that use more than one type of processor), with the top 15 systems all using NVIDIA Kepler K20 GPUs paired with Intel Xeon CPUs. Still at the top of the list is the Tokyo Institute of Technology GSIC Center’s TSUBAME-KFC, an oil-cooled Kepler powered ... » read more

DAC’s Front Line…Soha, Chuck And Me


In Brazil the drama continues, though that may be understating what happened yesterday. I’m still rendered nearly speechless by the result from Belo Horizonte, where all sorts of history was made. Of course I’m thrilled that Germany has a chance to win its first World Cup since 1990, though like much of Fussball-fandom I’m stunned and even a bit unnerved at how easy they made it look in t... » read more

The Week In Review: Manufacturing


As feature sizes continue to shrink and new device architectures are introduced, the IC industry will require new breakthroughs. In fact, feature dimensions will soon have tolerances that are on the order of a few atoms. For the most advanced structures, conventional plasma etch and deposition processes are unable to meet these requirements. As a result, the industry will require tools th... » read more

Confusion Does Not Equal Paralysis


After attending the two biggest semiconductor conferences in the world, along with a long list of notable conferences targeted to a wide variety of technologies and engineering disciplines, it’s clear the industry is racing ahead. But “ahead” is now a relative term. While Moore’s Law satisfied both economic and technological requirements, it was easy to figure out what “ahead” me... » read more

Server Memory: What Drives Its Growth?


I was recently reading several analyst reports that came out after the end of last quarter, and one caught my eye: "Gartner says Worldwide Server Shipments Grew 1.4%..." It caused me to wonder, how is it possible that server shipments only grow at modest rates, while the DRAM used in those servers is growing at significantly higher rates? Putting my search engine to use, I found a series of ... » read more

28nm FinFETs?


One star of the upcoming 14/16nm process node is the introduction of the finFET, a fundamentally new transistor that overcomes many of the limitations associated with planar transistors. While these devices are more complex to construct—and the physical extraction processes associated with them is more complex due to an increased number of resistances and capacitances—they are seen as a tra... » read more

Why An IBM Sale Matters


The rumored sale of IBM’s semiconductor unit to GlobalFoundries could add some interesting capabilities for the foundry, including deep process technology and expertise. It also could have some far-reaching effects for the entire semiconductor industry. The reason revolves around ongoing U.S. government initiatives to improve visibility for components throughout its supply chain. IBM has b... » read more

The Week In Review: Manufacturing


Looking to address a new wave of chip architectures in the marketplace, Applied Materials has rolled out its next-generation, medium-current ion implanter. The system, dubbed the VIISta 900 3D, is geared for the production of finFETs and 3D NAND designs at the sub-2xnm nodes. Typically, medium-current implanters have a maximum energy range of about 900keV (triple-charge), with dose ranges fr... » read more

← Older posts Newer posts →