tag: IBM

Momentum Builds For Monolithic 3D ICs
By Mark LaPedus - 14 Nov, 2013 - Comments: 1

The 2.5D/3D chip market is heating up on several fronts. On one front, stacked-die using through-silicon vias (TSVs) is taking root. In a separate area, Samsung is sampling the world’s first 3D NAND device, with Micron and SK Hynix expected to follow suit. And now, there is another technology generating steam—monolithic 3D integrated circuits. In stacked-die, bare die are connected using... » read more

Atoms, ARMs, ARCs, Andes…And All The Rest
By Brian Bailey - 07 Nov, 2013 - Comments: 0

There was a time when nobody believed Intel processors would be replaced with any other device. Intel commanded the processor market. Rich Wawrzyniak, senior analyst for ASIC SoC at Semico Research, noted this was not always the case. In the early days of the PC there were many contenders and most people thought that Motorola would win because they had more money behind them. Ultimately, Intel ... » read more

System Bits: Nov. 5
By Brian Bailey - 05 Nov, 2013 - Comments: 0

Silicon Photonics And Graphene The industry is looking towards silicon photonics that will increase the rate at which electronic systems can communicate with each other and reduce power consumption. Researchers at MIT, Columbia University and IBM’s T. J. Watson Research Center are already a few steps beyond the traditional attempts to build optical components using materials such as Gallium ... » read more

Manufacturing Bits: Oct. 1
By Mark LaPedus - 01 Oct, 2013 - Comments: 0

Nanoimprint Foundry Singapore’s A*STAR’s Institute of Materials Research and Engineering (IMRE) and its partners have launched a new R&D foundry using nanoimprint lithography. The so-called Nanoimprint Foundry is a collaboration between several entities, such as IMRE, Toshiba Machines, EV Group, NTT, NIL Technology, Kyodo International, Micro Resist Technology, Nanoveu and Solves In... » read more

Rethinking The Data Center
By Ed Sperling - 27 Sep, 2013 - Comments: 0

Ever since the introduction of the PC, the biggest challenge in computing has been more about getting software to take advantage of multiple processors or cores than getting the chips to run faster. Ironically, this issue was solved decades ago inside of data centers. Enterprise applications, built on databases, have always been relatively easy to parse so that individual pieces can be run sepa... » read more

New Architectures Redefining The Data Center
By Ed Sperling - 26 Sep, 2013 - Comments: 0

By Ed Sperling The cost of powering and cooling data centers, coupled with a better understanding of how enterprise-level applications can utilize hardware more effectively, are spawning a new wave of changes inside of data centers. Data centers are always evolving, but in this sector that evolution is deliberate and sometimes painstakingly slow. In fact, each major shift tends to last a de... » read more

MRAM Begins To Attract Attention
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus In the 1980s, there were two separate innovations that changed the landscape in a pair of related fields—nonvolatile memory and storage. In one effort, Toshiba invented the flash memory, thereby leading to NAND and NOR devices. On another front, physicists discovered the giant magnetoresistance (GMR) effect, a technology that forms the basis of hard disk drives, magnetores... » read more

HotChips: Power8
By Barry Pangrle - 12 Sep, 2013 - Comments: 2

It’s another year, another HotChips Conference and another update on IBM’s POWER processor. IBM continues to impress with its big iron processor, and this year it’s the new POWER8. IBM announced more details of its new POWER8 processor at HotChips and IBM now joins Intel at 22nm, but with the twist that IBM’s process is based on SOI technology. The POWER8 quadruples the thread count ... » read more

Under One Roof
By Ed Sperling - 12 Sep, 2013 - Comments: 0

By Ed Sperling Microsoft’s decision to buy Nokia’s phone business, Apple’s move to build its own chips to more effectively run its software, and Google’s effort to develop its own hardware for next-generation platforms such as Google Glass mark an interesting reversal in the electronics industry. Disaggregation was the answer to slow-moving giants such as big-iron companies. Startin... » read more

Experts At The Table: Who Pays For Low Power?
By Ed Sperling - 26 Jul, 2013 - Comments: 1

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss the cost of low power with Fadi Gebara, research staff member for IBM’s Austin Research Lab; David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Aveek Sarkar, vice president of product engineering and support at Apache Design; and Tim Whitfield, director ... » read more

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