tag: IEEE

Blog Review: Feb. 3
By Jesse Allen - 03 Feb, 2016 - Comments: 0

In this week's top five tech picks, Ansys' Bill Vandermark highlights a variety of breakthroughs which, working together, help boost self-driving cars. Rambus' Aharon Etengoff reviews the television show Mr. Robot, which he says may have as much potential impact as WarGames did in the 80s. Cadence's Paul McLellan looks at Conway's Law of business organization and the changing structure of... » read more

Enablement For A Decade Of Innovation
By Frank Schirrmeister - 28 Jan, 2016 - Comments: 0

As I do every January, I am looking back 5, 10, and 15 years to see what predictions did and did not turn out to be right, and how that relates to design technologies enabling those developments. Looking back five years reveals just how key system-development technologies were for what IEEE dubbed the “Top 11 Technologies of the Decade”. Looking back 10 years shows how they enabled communic... » read more

Manufacturing Bits: Dec. 29
By Mark LaPedus - 29 Dec, 2015 - Comments: 0

Printing hair Using a low-cost, 3D printing technique, Carnegie Mellon University has found a way to produce hair-like strands and fibers. The printer produces plastic hair strand by strand. It takes about 20-25 minutes to generate hair on 10 square millimeters. A video can be seen here. [caption id="attachment_24544" align="alignleft" width="300"] 3D printed hair (Photo: Carnegie Mellon... » read more

Manufacturing Bits: Dec. 15
By Mark LaPedus - 15 Dec, 2015 - Comments: 0

DRAM scaling sans EUV At the recent IEEE International Electron Devices Meeting (IEDM) in Washington, D.C., chipmakers presented papers on several technologies, including one unlikely topic—DRAM scaling. For years, it was believed that DRAMs would hit the wall and stop scaling at 20nm or so. Then, at that point, the industry would need to migrate to a 3D DRAM structure or a next-generatio... » read more

Manufacturing Bits: Dec. 8
By Mark LaPedus - 08 Dec, 2015 - Comments: 0

Quantum computing At this week’s IEEE International Electron Devices Meeting (IEDM) in Washington, D.C., chipmakers, research institutes and universities presented a plethora of papers on several subjects. A large number of papers revolve around the same theme—How to extend Moore’s Law. For this, researchers are working on a number of short- and long-term technologies to propel device... » read more

Security Improvements Ahead
By Ed Sperling - 10 Nov, 2015 - Comments: 0

After nearly two years of talking about how security is one of the biggest problems facing the IoE, progress is being made on a number of fronts. The changes involve many companies, both individually and collaboratively through standards groups. And while none of this will stop the kind of high-profile breaches that affected Target or Home Depot or JPMorgan Chase or a long list of other gian... » read more

Technology Reboot Required
By Brian Bailey - 29 Oct, 2015 - Comments: 1

The International Technology Roadmap for Semiconductors (ITRS) has produced reports outlining the major obstacles the electronics industry faces for a long time now. It attempts to project, with a 15-year horizon, the problems that need to be solved in order to take advantage of the complete design and manufacturing ecosystem. From this, early research efforts can be started. This enabled the E... » read more

Power/Performance Bits: Oct. 27
By Jesse Allen - 27 Oct, 2015 - Comments: 0

Searching for energy-efficient architectures A workshop jointly funded by the Semiconductor Research Corporation (SRC) and National Science Foundation (NSF) sought out the key factors limiting progress in computing – particularly related to energy consumption – and novel research that could overcome these barriers. The report focuses on the most promising research directions in the ex... » read more

Will The Chip Work?
By Ed Sperling - 26 Oct, 2015 - Comments: 0

As the number of possible issues mount for integrating IP into complex chips, so does the focus on solving these issues. What becomes quickly apparent to anyone integrating multiple IP blocks is that one size doesn't fit all, either from an IP or a tools standpoint. There is no single solution because there is no single way of putting IP together. Each architecture is unique, and each brings... » read more

Will The Chip Work?
By Ed Sperling - 19 Oct, 2015 - Comments: 1

IP is getting better, but the challenges of integrating it are getting worse. As the number of IP blocks in SoCs increases at each new process node, so does the difficulty of making them all work together. In some cases, this can mean extra code and a slight performance hit on power and performance. In other cases, it may require more drastic measures, ranging from a re-spin to a new archite... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy