tag: IHS Markit

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Jan, 2022 - Comments: 0

Fabs Intel has announced plans for an initial investment of more than $20 billion in the construction of two new leading-edge fabs in Ohio. Planning for the first two factories will start immediately, with construction expected to begin late in 2022. Production is expected to come online in 2025. As part of the announcement, Air Products, Applied Materials, Lam Research and Ultra Clean Technol... » read more

Automotive IC Shortage Drags On
By Patrick Waurzyniak - 20 May, 2021 - Comments: 1

The current automotive semiconductor shortages won’t end anytime soon. When the COVID-19 pandemic hit in early 2020, it wreaked havoc on the worldwide supply chain, but it especially caught automakers flat-footed. When the auto OEMs canceled chip orders during a roughly eight-week period of plant shutdowns, they later found their supplies of critical ICs had evaporated. To make it an ev... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 23 Apr, 2021 - Comments: 0

Automotive & transportation Chip shortages continue to affect automotive production lines and the bottom line of automotive OEMs. Jaguar Land Rover and Daimler this week said they will reduce production because chip supply issues. Other car companies have or are planning to temporarily shut down production lines. Renault, GM, Ford, Fiat Chrysler (now Stellantis), Volkswagen, Nissan, and Ho... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 02 Apr, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Arm announced its Armv9 architecture, which is designed for secure, pervasive computing that can run in more types of AI systems. Because most data will be touching an Arm-based chip in the near future — whether on the edge, IoT, or data center — Arm enhanced the security, in addition to improving performance and AI/ML capabil... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 06 Nov, 2020 - Comments: 0

Automotive Bosch licensed Arteris IP’s FlexNoC interconnect products for Bosch’s automotive chips. “Arteris IP provides the easiest and fastest means to assemble the complex chips we require while allowing us to implement innovative functional safety mechanisms within our designs,” said Oliver Wolst, senior vice president integrated circuits at Bosch. Mentor, a Siemens business, int... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 01 May, 2020 - Comments: 0

Data center, 5G security Nvidia won approval for its Mellanox Technologies Ltd. deal from China, according to an article on Bloomberg. Mellanox chips split up and manage AI datasets for parallel processing, which can be used in data centers for computing. Rambus has released security for 800 Gigbit Ethernet MAC (media access control) for enhanced data center and 5G infrastructure. It secure... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 09 Aug, 2019 - Comments: 0

Fab tools Lam Research has rolled out two new tools for use in the production of 3D NAND. The first tool, called the VECTOR DT, is geared for backside deposition. The second system, the EOS GS, is a wet etch tool for film removal on backside and bevel. Designed to control the wafer bow in 3D NAND manufacturing, the VECTOR DT system is the latest addition to Lam’s plasma-enhanced chemical ... » read more

200mm Cools Off, But Not For Long
By Mark LaPedus - 18 Jul, 2019 - Comments: 4

After years of acute shortages, 200mm fab capacity is finally loosening up, but the supply/demand picture could soon change with several challenges on the horizon. 200mm fabs are older facilities with more mature processes, although they still churn out a multitude of today’s critical chips, such as analog, MEMS, RF and others. From 2016 to 2018, booming demand for these and other chips ca... » read more

Machine Learning Inferencing Moves To Mobile Devices
By Kevin Fogarty - 02 Jul, 2019 - Comments: 0

It may sound retro for a developer with access to hyperscale data centers to discuss apps that can be measured in kilobytes, but the emphasis increasingly is on small, highly capable devices. In fact, Google staff research engineer Pete Warden points to a new app that uses less than 100 kilobytes for RAM and storage, creates an inference model smaller than 20KB, and which is capable of proce... » read more

Inspection, Metrology Challenges Grow For SiC
By Mark LaPedus - 11 Jun, 2019 - Comments: 2

Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

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