tag: Imagination Technologies

Automotive Outlook 2025: Ecosystem Pivots Around SDV
By Ann Mutschler - 06 Feb, 2025 - Comments: 0

The automotive industry is deep in the throes of a massive shift to software-defined vehicle architectures, a multi-year effort that will change the way automotive chips are designed, where they are used, and how they are sourced. Creating a new vehicle architecture is no small feat. OEMs need to figure out who to partner with and which aspects of their current architecture to include. This ... » read more

Transforming Industrial IoT With Edge AI And AR
By Eleanor Brash - 06 Feb, 2025 - Comments: 0

The Internet of Things (IoT) has evolved significantly from its early days of centralized cloud processing. Initially, IoT applications relied heavily on cloud-based data processing, where data from various devices was collected, processed, and analyzed in the cloud before insights were sent back to the devices. While effective, this approach has limitations, particularly in environments requir... » read more

Edge And IoT Security Turning A Corner
By Ed Sperling - 09 Jan, 2025 - Comments: 0

Security is beginning to improve for a wide range of IoT and edge devices due to better tools, the implementation of new standards and methodologies, and an increasing level of collaboration and communication across different market segments that in the past had little or no interaction. Until recently, many vendors in cost-sensitive markets offered the bare minimum of security. To make matt... » read more

The Use Of GPU Compute In Automotive
By Eleanor Brash - 09 Jan, 2025 - Comments: 0

The pace of innovation in automotive is accelerating. Electrification, advanced driver assistance systems (ADAS) and vehicle connectivity are revolutionizing the in-car experience, which is now largely determined by the capabilities of the car’s software and electronic hardware. When a vehicle can receive software upgrades while it is on the road, the electronic control units (ECUs) that a... » read more

Strain, Stress In Advanced Packages Drives New Design Approaches
By Ann Mutschler - 19 Dec, 2024 - Comments: 2

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, dependencies, and interactions, and driving demand for new tools. Unlike in the past, when various components were crammed into a planar SoC on a relatively thick substrate, the new substrates are bei... » read more

The Future Of Technology: Generative AI In China
By Eleanor Brash - 05 Dec, 2024 - Comments: 0

China's investment in Gen-AI is projected to surge with an estimated 86% CAGR over the next five years. This growth is driven by a focus on technological self-sufficiency, from applications to chips, and a strong emphasis on locally developed technology. Key areas of development include: AI Chip Development: Addressing the need for powerful AI infrastructure. Dataset Localization: S... » read more

Innovations In Distributed Functional Safety
By Imagination Technologies - 04 Dec, 2024 - Comments: 0

Innovations in hardware functional safety will be available in future safety-critical products from Imagination. These patent-pending techniques are for processing cores which require Automotive Safety Integrity Level (ASIL)-B levels of protection while incurring the smallest possible area, power and performance costs. This paper outlines new Distributed Safety Mechanisms (DSMs) for CPU and ... » read more

Cadence Cerebrus In SaaS And Imagination Technologies Case Study
By Cadence - 27 Mar, 2024 - Comments: 0

Artificial Intelligence (AI) has made noteworthy progress and is now ready and available for electronic design automation. The Cadence Cerebrus Intelligent Chip Explorer utilizes AI—specifically, reinforcement machine learning (ML) technology—combined with the industry-leading Cadence digital full flow to deliver better power, performance, and area (PPA) more quickly. However, this highl... » read more

Chip Industry Week In Review
By The SE Staff - 10 Nov, 2023 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Bosch, Infineon, and NXP were cleared in Germany to each acquire 10% of the European Semiconductor Manufacturing Co. (ESMC), established by TSMC, solidifying the supply chain against future shortages, particularly for automotive chips. “ESMC intends to build and operate another large semiconductor factory in Dresden, in which the three Europ... » read more

Chip Industry Week In Review
By The SE Staff - 13 Oct, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman. Canon uncorked a nanoimprint lithography system, which the company said will be useful down to about the 5nm node. Unlike traditional lithography equipment, which projects a pattern onto a resist, nanoimprint directly transfers images onto substrates using a master stamp patterned by an e-beam system. The technology has a number of limitations and... » read more

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