Sensors In Fire Detection

By Susan Rambo - 02 Jun, 2022 - Comments: 0

The last 10 years or so have produced some colossal and deadly fire events that have destroyed whole towns, burned a record amount of acreage, and polluted skies for weeks. And wildfires are not just happening in the Western United States but have burnt out of control in Europe, the Amazon, and Australia. Early wildfire detection and forest management via controlled burns are two ways to pre... » read more

Week In Review: Design, Low Power

By Jesse Allen - 27 May, 2022 - Comments: 0

EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week In Review: Design, Low Power

By Jesse Allen - 20 May, 2022 - Comments: 0

Cadence's digital full flow was certified for the GlobalFoundries 12LP/12LP+ process platforms. The certified tools include the Innovus Implementation System, Genus Synthesis Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Quantus Extraction Solution, Litho Physical Analyzer (LPA), and Pegasus Verification System. Siemens Digital Industries Software's Calibre nm... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 20 May, 2022 - Comments: 0

Automotive, mobility The number new energy vehicles (NEVs) sold went up 80% from year over year, says TrendForce in its review of market for Q1 2022. NEVs are battery electric vehicles (BEVs), plug-in hybrid electric vehicles (PHEVs), and fuel cell vehicles. Over 2.004 million units sold in the first quarter of 2022 (1Q22), with BEVs making the strongest showing at 1.508 million units, a 271% ... » read more

Week in Review: Manufacturing, Test

By Linda Christensen - 13 May, 2022 - Comments: 0

Industry Numbers NAND flash memory is forecast to hit US $83 billion this year, an increase of 24%. DRAM is projected to hit $118 billion, up 25%, according to a recent Yole report. Both are historic records. DRAM and NAND revenues are expected to be a $260 billion market in 2027 (combined), with advanced technologies such as EUV lithography, hybrid bonding and 3D DRAM driving this. SEMI in... » read more

Week In Review: Design, Low Power

By Jesse Allen - 13 May, 2022 - Comments: 0

Tools & IP MIPS announced its first products based on the RISC-V ISA. The eVocore IP cores are designed to provide a flexible foundation for heterogeneous compute, supporting combinations of eVocore processors as well as other accelerators, with a Coherence Manager that maintains L2 cache and system-level coherency between all cores, main memory, and I/O devices. They target high-performan... » read more

Building High Voltage Automotive Battery Management Systems

By Infineon - 11 May, 2022 - Comments: 0

To ensure safety, performance and accuracy over the full system lifetime, it is essential to choose the right BMS components. This can also maximize the range and lifetime obtainable from the Li-ion battery, which is a vital differentiator for carmakers. The paper gives a general introduction to Li-ion batteries and BMS, before presenting Infineon’s products and system approach towards offer... » read more

Week In Review: Design, Low Power

By Jesse Allen - 06 May, 2022 - Comments: 0

Rambus will acquire Hardent, a provider of design services and IP. Rambus said Hardent's silicon design, verification, compression, and Error Correction Code (ECC) expertise will provide key resources for the Rambus CXL Memory Interconnect Initiative. “Driven by the demands of advanced workloads like AI/ML and the move to disaggregated data center architectures, industry momentum for CXL-base... » read more

Building Security Into ICs From The Ground Up

By John Koon - 05 May, 2022 - Comments: 0

Cyberattacks are becoming more frequent and more sophisticated, but they also are starting to compromise platforms that until recently were considered unbreakable. Consider blockchains, for example, which were developed as secure, distributed ledger platforms. All of them must be updated with the same data for a transaction to proceed. But earlier this year a blockchain bridge platform calle... » read more

Making More Reliable And More Efficient Auto ICs

By Ed Sperling - 05 May, 2022 - Comments: 0

Sam Geha, executive vice president of memory solutions at Infineon Technologies, sat down with Semiconductor Engineering to talk about automotive chips, supply chain issues, and integration challenges. What follows are excerpts of that conversation. SE: How do you build an automotive chip that will work in any environment? Geha: The automotive market is, of course, one of the most demand... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Infineon Technologies

Sensors In Fire Detection

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Week in Review: Manufacturing, Test

Week In Review: Design, Low Power

Building High Voltage Automotive Battery Management Systems

Week In Review: Design, Low Power

Building Security Into ICs From The Ground Up

Making More Reliable And More Efficient Auto ICs