tag: Infineon

Automotive Safety: Having The Right Product Portfolio In Place
By Infineon - 04 Jan, 2023 - Comments: 0

Changes are happening in almost every aspect of automotive technology, although the main thrust can be encompassed in three megatrends. In the future, vehicles will be increasingly connected, and therefore cybersecurity protection is becoming more and more important. e-mobility will be a major contributor to CO2 reduction, resulting in the need for high-power semiconductors. And automated drivi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 22 Dec, 2022 - Comments: 0

Automotive, Mobility Automotive chip shortages will continue until 2025, according to reports in a Financial Times (FT) article. Demand for SiC power chips will remain high. Onsemi reportedly is already sold out of the power semiconductors. Archer Aviation’s Midnight eVTOL (electric vertical take-off and landing) is listed in the Federal Register now by The U.S. Federal Aviation Administr... » read more

High Voltage Testing Races Ahead
By Karen Heyman - 06 Dec, 2022 - Comments: 1

Voltage requirements are increasing, especially for the EV market. Even devices that might be considered relatively low voltage, such as display drivers, are now pushing past established baselines. While working with high voltages is nothing new — many engineers can recall yellow caution tape in their workplaces — the sheer number and variety of new requirements have made testing at high... » read more

A Customized Low-Cost Approach For S-Parameter Validation Of ATE Test Fixtures
By Zhenhua Chen - 06 Dec, 2022 - Comments: 0

This article summarizes the content of a paper jointly developed and presented by Advantest and Infineon at TestConX 2022. Device under test (DUT) fixtures for ATE systems pose several verification challenges. Users need to measure the DUT test fixture quickly and easily, while making sure the measurements mimic the ATE-to-test-fixture interface performance and determining how to handle DUT ... » read more

Why Matter 1.0 Really Matters
By Ed Sperling - 05 Dec, 2022 - Comments: 0

Incompatibilities of consumer devices inside the home are frustrating for consumers and a security risk. Skip Ashton, distinguished engineer at Infineon, talks about how the Matter 1.0 standard will fuse together different ecosystems from companies such as Apple, Google, and Amazon, how it will be applied to existing devices, what’s included and missing from the standard today, and how it can... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 02 Dec, 2022 - Comments: 0

Automotive, Mobility The U.S. space agency NASA entered a $57.2 million contract with ICON to develop technology to build roads on the moon. ICON, a Texas-based 3D printing construction company, has been working with NASA and the U.S. Air Force on construction technologies that can use local materials to build infrastructure on Mars. NASA is working on advanced 3D printing construction systems... » read more

A Solar Solution For Every Situation
By Suresh Thangavel - 01 Dec, 2022 - Comments: 0

Regardless of where they are used, energy conversion efficiency is paramount in solar power applications (if you are interested in their technical details, here is a blog post for you). Even small improvements reduce energy waste, decrease operating costs, lower spatial and cooling systems requirements, and much more. The semiconductor switches used in energy conversion in photovoltaic (... » read more

How To Make The Charging Infrastructure For Electric Vehicles Smart
By Infineon - 30 Nov, 2022 - Comments: 0

Renewable energies and the increasing emergence of electric vehicles are putting a strain on the electricity grid. The former are not constantly available, and the latter require additional energy while charging. This leads to the need for introducing a new, smart charging infrastructure to avoid instabilities at the grid level. This white paper explains what is involved in making a charging in... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 18 Nov, 2022 - Comments: 0

Automotive, mobility Infineon has a non-binding Memorandum of Understanding to supply automaker Stellantis with CoolSiC “bare die” chips by reserving manufacturing capacity in the second half of the decade to the direct Tier 1 suppliers of Stellantis. CoolSiCs are Infineon’s silicon carbide (SiC) semiconductors. Stellantis will acquire aiMotive, a startup specializing in AI and autono... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 18 Nov, 2022 - Comments: 0

Tools and IP Cadence announced that its IP for GDDR6 is now silicon-proven for TSMC’s N5 process technology. The IP consists of Cadence PHY,  controller design IP, and verification IP (VIP), and is targeted for very high-bandwidth memory applications. “The improved PHY and controller design IP for GDDR6 with DRAM data rates at 22Gbps in the TSMC N5 process is the fastest of the GDDR6 fami... » read more

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