5 Takeaways From Semicon


At the recent Semicon West trade show in San Francisco, there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs, equipment and packaging. Clearly, though, the show is much smaller with fewer attendees, as compared to past years. Most of the big companies no longer have booths. Hardly any have press events or med... » read more

The Week In Review: Manufacturing


Market research SEMI has released its mid-year forecast at Semicon West. SEMI reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase by 19.8% to a total of $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000. In 2018, 7.7% growth is expected, resulting in an... » read more

Inside Chip R&D


Semiconductor Engineering sat down to discuss R&D challenges, EUV and other topics with Luc Van den hove, president and chief executive of Imec, an R&D organization in Belgium. What follows are excerpts of that conversation. SE: Clearly, Moore’s Law is slowing down. The traditional process cadence is extending from 2 years to roughly 2.5 to 3 years. Yet, R&D is not slowing down, right? ... » read more

Inside Lithography And Masks


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cove... » read more

Inside EUV Resists


Andrew Grenville, chief executive of resist maker Inpria, sat down with Semiconductor Engineering to talk about photoresists for extreme ultraviolet (EUV) lithography. What follows are excerpts of that conversation. SE: Photoresists are a critical part of lithography. Resists are light-sensitive materials. They form patterns on a surface when exposed to light. For EUV, they are critical. Wha... » read more

EUV Resists Move Forward


Improvements in EUV exposure sources and exposure tools are shifting the industry’s focus to other components of the lithography process. As noted last year, one of the key areas is photoresists. But advanced photoresists face significant challenges, due to the need to balance sensitivity, etch selectivity, and resolution. This year’s SPIE Advanced Lithography conference featured promis... » read more

Multi-Beam Market Heats Up


The multi-beam e-beam mask writer business is heating up, as Intel and NuFlare have separately entered the emerging market. In one surprising move, [getentity id="22846" e_name="Intel"] is in the process of acquiring IMS Nanofabrication, a [gettech id="31058" t_name="multi-beam e-beam"] equipment vendor. And separately, e-beam giant NuFlare recently disclosed its new multi-beam mask writer t... » read more

The Week In Review: Manufacturing


Is robotics the next big thing? IDC forecasts that global spending on robotics and related services will grow at a compound annual growth rate (CAGR) of 17% from more than $71 billion in 2015 to $135.4 billion in 2019. "Robotics is one of the core technologies that is enabling significant change in manufacturing through factory of the future initiatives. While traditionally used in the automoti... » read more

The Next Resists…Continued


As previously discussed, conventional chemically-amplified resists are struggling to balance the competing requirements of EUV lithography. Simultaneously meeting the industry’s targets for resolution, sensitivity, and line-edge roughness may require new resist concepts. Inpria’s resist technology, based on tin-oxide nano clusters, is one possibility. Recently published work at SUNY Albany ... » read more

The Next Resists


As EUV exposure tools, sources, and photomasks have become more capable, the lithography sector’s attention has turned to EUV photoresist. After all, once the exposure system can produce a high quality image at the wafer, the resist still has to capture it for pattern transfer. Unfortunately, the increasing emphasis on photoresist has made the limitations of current formulations even more obv... » read more

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