Sponges, Skyscrapers, And Low-K

By Katherine Derbyshire - 20 Apr, 2015 - Comments: 1

A sponge is a porous structure. So is a skyscraper. These two very different images exemplify the materials being considered for advanced low dielectric constant (κ) materials. Most porous dielectrics that have been tested up to this point resemble sponges. As Intel’s David Michalak explained at this month's Materials Research Society (MRS) Spring Meeting, these materials consist of a ba... » read more

Manufacturing Bits: April 1

By Mark LaPedus - 01 Apr, 2014 - Comments: 0

Portable laser weapons For years, the U.S. military has been developing high-energy laser (HEL) weapons. But the massive size, weight and power requirements of laser systems limit their use on many military platforms. The Defense Advanced Research Projects Agency (DARPA) has made a breakthrough in its so-called Excalibur program. The program will develop laser weapons that are 10 times ligh... » read more

Manufacturing Bits: Feb. 18

By Mark LaPedus - 18 Feb, 2014 - Comments: 1

Polite cupcake helping robots Cornell and Carnegie Mellon have made a new discovery about robots. If they sound less snippy when they communicate, listeners will respond better. In fact, developers of robots should develop systems that use less confrontational language. In the study, entitled “How a Robot Should Give Advice,” researchers discovered that robots and humans are more lik... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Insulators

Sponges, Skyscrapers, And Low-K

Manufacturing Bits: April 1

Manufacturing Bits: Feb. 18