tag: Intel

NAND Market Hits Speed Bump
By Mark LaPedus - 21 Jun, 2017 - Comments: 5

Demand for NAND flash memory remains robust due to the onslaught of data in systems, but the overall NAND flash market is stuck in the middle of a challenging period beset by product shortages, supply chain issues and a difficult technology transition. Intel, Micron, Samsung, SK Hynix and the Toshiba/Western Digital duo continue to ship traditional planar NAND in the market, but this technol... » read more

Shrink Or Package?
By Ed Sperling - 19 Jun, 2017 - Comments: 0

Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around this shift, the reality is that it has taken more than a half-century to materialize. Advanced [getkc id="27" kc_name="packaging"] began with IBM flip chips in the 1960s, and it got another boost ... » read more

Architecture First, Node Second
By Ed Sperling - 15 Jun, 2017 - Comments: 0

What a difference a node makes. A couple of rather important changes have occurred in the move from 16/14 to 10/7nm (aside from more confusing naming conventions). First, companies that require more transistors—processor companies such as [getentity id="22846" e_name="Intel"], AMD, [getentity id="22306" comment="IBM"] and [getentity id="22676" e_name="Qualcomm"]—have come to grips with t... » read more

Going Vertical?
By Debra Vogler - 15 Jun, 2017 - Comments: 0

The topic of transistor scaling has been traditionally covered at SEMICON West in its own right. This year’s event, however, will also explore scaling in 3D, as well as using packaging to accomplish similar objectives. Along with traditional transistor scaling, speakers will tackle design and metrology considerations for scaling the package, and address the economic decisions that inform dens... » read more

Inside FD-SOI And Scaling
By Mark LaPedus - 15 Jun, 2017 - Comments: 5

Gary Patton, chief technology officer at [getentity id="22819" comment="GlobalFoundries"], sat down with Semiconductor Engineering to discuss FD-SOI, IC scaling, process technology and other topics. What follows are excerpts of that conversation. SE: In logic, GlobalFoundries is shipping 14nm finFETs with 7nm in the works. The company is also readying 22nm FD-SOI technology with 12nm FD-SOI ... » read more

2.5D, ASICs Extend to 7nm
By Mark LaPedus - 13 Jun, 2017 - Comments: 2

The leading-edge foundry market is heating up. For example, GlobalFoundries, Intel, Samsung and TSMC have recently announced their new and respective processes. The new processes from vendors range anywhere from 10nm to 4nm, although the current battle is taking place at 10nm and/or 7nm. In fact, one vendor, GlobalFoundries, this week will describe more details about its previously-announced... » read more

The LiDAR Gold Rush
By Jeff Dorsch - 12 Jun, 2017 - Comments: 0

Big money is pouring into the LiDAR market, as carmakers gear up for autonomous and assisted driving. LiDAR, along with advanced computer vision and radar sensors, is an essential component for vehicles to maneuver without hitting obstacles or other cars. LiDAR is an acronym for light imaging, detection, and ranging, and until now it has been almost synonymous with next-generation automotive... » read more

Age Of Acceleration
By Ed Sperling - 08 Jun, 2017 - Comments: 0

A shift from the fastest processors to accelerating specific functions is underway, supplanting an era of dark silicon in which one or more processor cores remain in a ready state whenever a single core's performance bogs down. In effect, the dark silicon/multi-core approach is being scrapped for many functions in favor of an accelerator-based microarchitecture that is far more granular. The... » read more

Fab Spending Hits New High
By Christian Dieseldorff - 07 Jun, 2017 - Comments: 0

The latest update to the World Fab Forecast report, published on May 31, 2017 by SEMI, reveals record spending for fab construction and fab equipment. Korea, Taiwan, and China all see large investments, and spending in Europe has also increased significantly. In 2017, over US$49 billion will be spent on equipment alone, a historic record for the semiconductor industry. Spending on new fab cons... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Jun, 2017 - Comments: 0

Market research IC Insights has released its capital spending forecast by company. In total, there are 15 companies that are forecast to have semiconductor capital expenditures of $1.0 billion or more in 2017, up from 11 in 2016, according to IC Insights. Four companies—Intel, Samsung, GlobalFoundries, and SK Hynix—are expected to represent the bulk of the increase in spending, accord... » read more

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