tag: Intel

Blog Review: Feb. 8
By Jesse Allen - 08 Feb, 2017 - Comments: 0

Mentor's Craig Armenti looks at some of the challenges involved with multi-board PCB or system design. Cadence's Paul McLellan highlights a presentation by Igor Keller on the state of the art in static timing analysis. Synopsys' Eric Huang has some ideas for USB interoperability testing. Intel's Ron Wilson delves into the current state of 5G, and why perspectives on that differ. Ans... » read more

The Week In Review: IoT
By Jeff Dorsch - 03 Feb, 2017 - Comments: 0

Finance NXP Semiconductors reported its Secure Connected Devices group posted revenue of $569 million in the fourth quarter, a gain of 10% from a year earlier. NXP CEO Richard Clemmer said in a statement, “All major product lines contributed to a seasonally solid quarter.” The chip company reported Q4 revenue of $2.44 billion and 2016 revenue of nearly $9.5 billion. Consortia Bosch, C... » read more

Work Remains To Enable Connected Cars, Automotive Security
By Ann Mutschler - 02 Feb, 2017 - Comments: 0

The automotive industry continues to chug along, evolving constantly with focus on a number of technology areas including ADAS applications, electric vehicles, infotainment, and security. And thankfully, there is still time left on the fully autonomous roadmap for these issues to get worked out. As part of this time of significant changes, the automotive OEMs are continuing to adjust as well... » read more

The Week In Review: IoT
By Jeff Dorsch - 27 Jan, 2017 - Comments: 0

Finance Ring, which sells Internet-connected doorbells, security cameras, and other products, received another $109 million in private funding, bringing its total funding to $209 million. DFJ Growth, Goldman Sachs Investment Partners, and Qualcomm Ventures led the Series D round, with participation by Richard Branson and other existing investors. Ring says its products are available in 100 cou... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Jan, 2017 - Comments: 0

Chipmakers 2017 is just getting underway and there appears to be more restructuring in the IC industry. Toshiba is looking to spin off its semiconductor division and Western Digital (WD) plans to take a minority stake, according to Nikkei, which added that Toshiba would sell a 20% stake for 200-300 billion yen ($1.78-$2.65 billion). “The arrangement would provide Toshiba with short term fund... » read more

The Week In Review: IoT
By Jeff Dorsch - 20 Jan, 2017 - Comments: 0

Products Intel on Monday unveiled the Responsive Retail Platform, with CEO Brian Krzanich making a presentation at the National Retail Federation’s Big Show conference. “Intel’s Internet of Things (IoT) and cloud technologies touch every link of the retail supply chain. IoT sensors capture data that can be analyzed. Data centers crunch the information and give it real-world usefulness,�... » read more

5 Takeaways From ISS
By Mark LaPedus - 19 Jan, 2017 - Comments: 1

At the recent Industry Strategy Symposium (ISS) in Half Moon Bay, Calif., there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs and equipment. It also discussed the latest business and technology trends. In no particular order, here are my five takeaways from ISS: Bullish outlook Citing an inventory corre... » read more

Inside Photomask Writing
By Mark LaPedus - 19 Jan, 2017 - Comments: 0

Hirokazu Yamada, a board member and the director of the Mask Lithography Division of NuFlare, sat down with Semiconductor Engineering to discuss photomask technology, e-beam mask writer trends and other topics. NuFlare is the world’s largest supplier of e-beam mask writers. What follows are excerpts of that conversation. SE: How does the [getkc id="265" kc_name="photomask"] market look in... » read more

China Unveils Memory Plans
By Mark LaPedus - 19 Jan, 2017 - Comments: 2

Backed by billions of dollars in government funding, China in 2014 launched a major initiative to advance its domestic semiconductor, IC-packaging and other electronic sectors. So far, though, the results are mixed. China is making progress in IC-packaging, but the nation’s efforts to advance its domestic logic and memory sectors are still a work in progress. In fact, China has yet to achi... » read more

Blog Review: Jan. 11
By Jesse Allen - 11 Jan, 2017 - Comments: 0

Mentor's Ron Press examines why test hasn't become a bottleneck in creating ever more advanced semiconductors. Synopsys' Graham Etchells warns that while finFET technologies have been successful, challenges persist. Cadence's Paul McLellan shares a behind-the-scenes look at developing the Palladium Z1 emulator. The White House's Craig Mundie and Paul Otellini highlight a PCAST report o... » read more

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