New End Markets, More Demand For Complex Chips

By Ed Sperling - 16 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss economic conditions and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front... » read more

Week In Review: Design, Low Power

By Jesse Allen - 13 May, 2022 - Comments: 0

Tools & IP MIPS announced its first products based on the RISC-V ISA. The eVocore IP cores are designed to provide a flexible foundation for heterogeneous compute, supporting combinations of eVocore processors as well as other accelerators, with a Coherence Manager that maintains L2 cache and system-level coherency between all cores, main memory, and I/O devices. They target high-performan... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 13 May, 2022 - Comments: 0

Automotive, mobility Fraunhofer IIS has opened a five-kilometer (3.11-mile) 5G test bed for automotive 5G applications near the city of Rosenheim in Bavaria, Germany. A closed 5G network with multiple base stations covers the test track, where connected cars can be tested under real conditions. “The automotive test bed is designed specially for developers and users that want to test new conn... » read more

Lots Of Data, But Uncertainty About What To Do With It

By Ed Sperling - 09 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management in heterogeneous designs, where sensors produce a flood of data, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer science at Stanford University... » read more

Rambus To Buy Hardent

By Ed Sperling - 05 May, 2022 - Comments: 0

Rambus inked a deal to buy Hardent, an engineering services company, in order to accelerate Rambus' push into the CXL arena. Compute Express Link (CXL), developed primarily by Intel before being turned into an open industry standard, allows memory to be disaggregated within a data center and shared across multiple servers. This, in turn, lets data centers control how critical resources are a... » read more

Blog Review: May 4

By Jesse Allen - 04 May, 2022 - Comments: 0

In a podcast, Arm's Geof Wheelwright chats with Steve Furber of the University of Manchester and Christian Mayr of Technische Universität Dresden about spiking neural networks and the SpiNNaker project to build a platform for realistic real-time models of brain functions. Synopsys' Licinio Sousa checks out how the MIPI protocol enables the connectivity needed for sensor fusion and increasin... » read more

Week In Review: Manufacturing, Test

By Ed Sperling - 29 Apr, 2022 - Comments: 0

It's earnings season, and despite widespread reports of capacity issues and shortages, the chip industry turned in relatively solid results across the board. Intel exceeded January guidance for Q1, reporting first-quarter GAAP revenue of $18.4 billion, a 7% year-over-year decrease, and a 1% decrease year-over-year on non-GAAP basis. Record revenue was achieved in the Network and Edge Group, ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 29 Apr, 2022 - Comments: 0

Automotive, mobility DENSO Corporation and UMC’s Japanese subsidiary United Semiconductor Japan Co., Ltd. (USJC) are collaborating on power semiconductors production for the automotive market at USJC’s 300mm fab. USJC will install an insulated gate bipolar transistor (IGBT) line at its wafer fab. Renesas Electronics uncorked an integrated automotive ECU Virtualization Platform for devel... » read more

Choosing Which Tasks To Optimize In Chips

By Brian Bailey - 28 Apr, 2022 - Comments: 0

The optimization of one or more tasks is an important aspect of every SoC created, but with so many options now on the table it is often unclear which is best. Just a few years ago, most people were happy to buy processors from the likes of Intel, AMD and Nvidia, and IP cores from Arm. Some even wanted the extensibility that came from IP cores like Tensilica and ARC. Then, in 2018, John Henn... » read more

Technical Paper Round-up: April 26

By Linda Christensen - 26 Apr, 2022 - Comments: 0

Find all technical papers in Semiconductor Engineering’s library. [table id=23 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Intel

New End Markets, More Demand For Complex Chips

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Lots Of Data, But Uncertainty About What To Do With It

Rambus To Buy Hardent

Blog Review: May 4

Week In Review: Manufacturing, Test

Week In Review: Auto, Security, Pervasive Computing

Choosing Which Tasks To Optimize In Chips

Technical Paper Round-up: April 26