Blog Review: May 4

By Jesse Allen - 04 May, 2022 - Comments: 0

In a podcast, Arm's Geof Wheelwright chats with Steve Furber of the University of Manchester and Christian Mayr of Technische Universität Dresden about spiking neural networks and the SpiNNaker project to build a platform for realistic real-time models of brain functions. Synopsys' Licinio Sousa checks out how the MIPI protocol enables the connectivity needed for sensor fusion and increasin... » read more

Week In Review: Manufacturing, Test

By Ed Sperling - 29 Apr, 2022 - Comments: 0

It's earnings season, and despite widespread reports of capacity issues and shortages, the chip industry turned in relatively solid results across the board. Intel exceeded January guidance for Q1, reporting first-quarter GAAP revenue of $18.4 billion, a 7% year-over-year decrease, and a 1% decrease year-over-year on non-GAAP basis. Record revenue was achieved in the Network and Edge Group, ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 29 Apr, 2022 - Comments: 0

Automotive, mobility DENSO Corporation and UMC’s Japanese subsidiary United Semiconductor Japan Co., Ltd. (USJC) are collaborating on power semiconductors production for the automotive market at USJC’s 300mm fab. USJC will install an insulated gate bipolar transistor (IGBT) line at its wafer fab. Renesas Electronics uncorked an integrated automotive ECU Virtualization Platform for devel... » read more

Choosing Which Tasks To Optimize In Chips

By Brian Bailey - 28 Apr, 2022 - Comments: 0

The optimization of one or more tasks is an important aspect of every SoC created, but with so many options now on the table it is often unclear which is best. Just a few years ago, most people were happy to buy processors from the likes of Intel, AMD and Nvidia, and IP cores from Arm. Some even wanted the extensibility that came from IP cores like Tensilica and ARC. Then, in 2018, John Henn... » read more

Technical Paper Round-up: April 26

By Linda Christensen - 26 Apr, 2022 - Comments: 0

Find all technical papers in Semiconductor Engineering’s library. [table id=23 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a ... » read more

Paving The Way To Chiplets

By Mark LaPedus - 25 Apr, 2022 - Comments: 2

The packaging industry is putting pieces in place to broaden the adoption of chiplets beyond just a few chip vendors, setting the stage for next-generation 3D chip designs and packages. New chiplet standards, and a cost analysis tool for determining the feasibility of a given chiplet-based design, are two new and important pieces. Along with other efforts, the goal is to propel the chiplet m... » read more

Hardware-Supported Patching of Security Bugs in Hardware IP Blocks

By Technical Paper Link - 22 Apr, 2022 - Comments: 0

New research paper from Duke University, University of Calgary, NYU & Intel. Abstract: "To satisfy various design requirements and application needs, designers integrate multiple Intellectual Property blocks (IPs) to produce a system-on-chip (SoC). For improved survivability, designers should be able to patch the SoC to mitigate potential security issues arising from hardware IPs; for incre... » read more

Photomask Shortages Grow At Mature Nodes

By Mark LaPedus - 21 Apr, 2022 - Comments: 2

A surge in demand for chips at mature nodes, coupled with aging photomask-making equipment at those geometries, are causing significant concern across the supply chain. These issues began to surface only recently, but they are particularly worrisome for photomasks, which are critical for chip production. Manufacturing capacity is especially tight for photomasks at 28nm and above, driving up ... » read more

Week In Review: Manufacturing, Test

By Linda Christensen - 15 Apr, 2022 - Comments: 0

Photonic Chips Go Big In Europe PhotonDelta, a collaborative end-to-end supply chain for the application of photonics chips, secured €1.1 billion in conditional funding for a six-year initiative. Investments from the Netherlands government and other organizations “will be used to build 200 startups, scale up production, create new applications for photonic chips, and develop infrastructure... » read more

Increasing Performance With Data Acceleration

By Martha DeGrasse - 14 Apr, 2022 - Comments: 0

Increasing demand for functions that require a relatively high level of acceleration per unit of data is providing a foothold for in-line accelerator cards, which could mean new opportunities for some vendors and a potential threat for others. For years, either CPUs, or CPUs with FPGA accelerators, met most market needs. But the rapid increase in the volume of data everywhere, coupled with t... » read more

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Entities, people and technologies explored

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: Intel

Blog Review: May 4

Week In Review: Manufacturing, Test

Week In Review: Auto, Security, Pervasive Computing

Choosing Which Tasks To Optimize In Chips

Technical Paper Round-up: April 26

Paving The Way To Chiplets

Hardware-Supported Patching of Security Bugs in Hardware IP Blocks

Photomask Shortages Grow At Mature Nodes

Week In Review: Manufacturing, Test

Increasing Performance With Data Acceleration

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Knowledge Centers
Entities, people and technologies explored