tag: Intel

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 31 Jul, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT, 5G Qualcomm settled its 5G licensing disagreement with Huawei, which will pay $1.8 billion in back royalties and will pay for licensing going forward. Huawei is also now the world’s largest supplier of smartphones, surpassing Samsung Electronics Co. Qualcomm also announced a super-fast charging platform this week for Android devices that is sup... » read more

Next Challenge: Parts Per Quadrillion
By Ed Sperling - 29 Jul, 2020 - Comments: 0

Requirements for purity of the materials used in semiconductor manufacturing are being pushed to unprecedented — and increasingly unprovable — levels as demand for reliability in chips over increasingly longer lifetimes continues to rise. And while this may seem like a remote problem for many parts of the supply chain, it can affect everything from availability of materials needed to make t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Jul, 2020 - Comments: 0

Semicon recap The virtual version of Semicon West took place this week. Virtual events have their places. It’s no substitute for an in-person event. Nonetheless, the virtual version of Semicon West is still a place to get an update on the latest equipment, test and packaging technologies. It is also interesting to visit the virtual booths. It’s a fast way to meet people. I chatted with ... » read more

The Race To Much More Advanced Packaging
By Mark LaPedus - 23 Jul, 2020 - Comments: 2

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

eFPGAs Vs. FPGA Chiplets
By Ed Sperling - 22 Jul, 2020 - Comments: 0

Embedded FPGAs are a totally different concept from discrete FPGA chiplets, and that is reflected in size, cost, power and performance. Geoff Tate, CEO of Flex Logix, talks about which applications are best for each, how each maximizes power and performance, and why choices will vary greatly by application. Related eFPGA Knowledge Center FPGA Knowledge Center Increasing EFPGA Densit... » read more

Semicon West Day One/Two
By Mark LaPedus - 22 Jul, 2020 - Comments: 0

For years, the semiconductor and equipment industry has congregated at the annual Semicon West trade show in San Francisco. It’s an event to get an update on the latest equipment, test and packaging technologies. It’s also a good way to meet with people who you haven’t seen in a year, if not longer. It’s a great way to get a pulse on the industry. Needless to say, Semicon is a vir... » read more

Manufacturing Bits: July 21
By Mark LaPedus - 21 Jul, 2020 - Comments: 1

Intel’s next-gen MRAM At the recent 2020 Symposia on VLSI Technology and Circuits, Intel presented a paper on a CMOS-compatible spin-orbit torque MRAM (SOT-MRAM) device. Still in R&D, SOT-MRAM is a next-generation MRAM designed to replace SRAM. Generally, processors integrate a CPU, SRAM and a variety of other functions. SRAM stores instructions that are rapidly needed by the processo... » read more

Speeding Up The R&D Metrology Process
By Mark LaPedus - 16 Jul, 2020 - Comments: 0

Several chipmakers are making some major changes in the characterization/metrology lab, adding more fab-like processes in this group to help speed up chip development times. The characterization/metrology lab, which is generally under the radar, is a group that works with the R&D organization and the fab. The characterization lab is involved in the early analytical work for next-generati... » read more

Integrating FPGA: Comparison Of Chiplets Vs. eFPGA
By Geoff Tate - 15 Jul, 2020 - Comments: 0

FPGA is widely popular in systems for its flexibility and adaptability. Increasingly, it is being used in high volume applications. As volumes grow, system designers can consider integration of the FPGA into an SoC to reduce cost, reduce power and/or improve performance. There are two options for integrating FPGA into an SoC: FPGA chiplets, which replace the power hungry SERDES/PHYs wit... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Jul, 2020 - Comments: 0

IoT Arm is proposing to transfer its two IoT divisions to SoftBank Group Corp., which will own and operate them under new entities. The two IoT Services Group (ISG) businesses are IoT Platform and Treasure Data. Arm intends to focus more on its IP roadmap in data and compute, once the transfer becomes finalized. It is subject to more board review. “Arm believes there are great opportunities ... » read more

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