tag: Intel

Momentum Builds For Advanced Packaging
By Mark LaPedus - 17 Sep, 2020 - Comments: 0

The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs. Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce p... » read more

Making Everything Linux-Capable
By Ed Sperling - 04 Sep, 2020 - Comments: 0

It's not clear how the edge will play out or what will be the winning formula from a hardware standpoint. But for everything beyond the end device, and possibly even including the end device, a key prerequisite will be the ability to run Linux. That means at least one processor or core within the hardware will need to run 64-bit software. In addition, systems will need to have enough storage... » read more

Interconnects Emerge As Key Concern For Performance
By Ed Sperling - 03 Sep, 2020 - Comments: 0

Interconnects are becoming increasingly challenging to design, implement and test as the amount of data skyrockets and the ability to move that data through denser arrays of compute elements and memories becomes more difficult. The idea of an interconnect is rather simple, but ask two people what constitutes an interconnect and you're likely to get very different answers. Interconnects are e... » read more

Manufacturing Bits: Sept. 1
By Mark LaPedus - 01 Sep, 2020 - Comments: 0

AI, quantum computing R&D centers The White House Office of Science and Technology Policy, the National Science Foundation (NSF), and the U.S. Department of Energy (DOE) have announced over $1 billion in awards for the establishment of several new artificial intelligence and quantum information science (QIS) research institutes in the U.S. Under the plan, the U.S. is launching seven new... » read more

New Architectures, Much Faster Chips
By Ed Sperling and Ann Mutschler - 31 Aug, 2020 - Comments: 0

The chip industry is making progress in multiple physical dimensions and with multiple architectural approaches, setting the stage for huge performance increases based on more modular and heterogeneous designs, new advanced packaging options, and continued scaling of digital logic for at least a couple more process nodes. A number of these changes have been discussed in recent conferences. I... » read more

Moore’s Law Enters The 4th Dimension
By Ed Sperling - 21 Aug, 2020 - Comments: 5

The basic idea that more transistors are better hasn't changed in more than half a century. In fact, the overriding theme of a number of semiconductor conferences this month is that we will never have enough compute capability or storage capacity. In the past, when the number of transistors in a given area actually did double every 18 to 24 months, increasing density per square millimeter fo... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 21 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT SEMI formed a new standards committee to develop global standards for flexible hybrid electronics (FHE). The SEMI Standards Flexible Hybrid Electronics Global Technical Committee will develop FHE standards for design, materials, manufacturing, packaging and systems and to drive industry growth. IPC is also working on FHE standards as an industry s... » read more

From Cloud To Cloudlets
By Ed Sperling - 17 Aug, 2020 - Comments: 0

Cloudlets, or mini-clouds, are starting to roll out closer to the sources of data in an effort to reduce latency and improve overall processing performance. But as this approach gains steam, it also is creating some new challenges involving data distribution, storage and security. The growing popularity of distributed clouds is a recognition that the cloud model has limitations. Sending the ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Aug, 2020 - Comments: 0

Chipmakers At its Architecture Day this week, Intel disclosed its roadmap for the company’s next-generation microprocessors, graphics chips, FPGAs and other products. As part of the event, Intel announced some new enhancements for its existing 10nm finFET technology. Basically, it’s a mid-life kicker for the technology. Intel calls it the 10nm SuperFin technology, which is a redefinitio... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 14 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Maxim Integrated’s new USB-C Power Delivery products — the MAX77958 USB-C PD controller and the MAX77962 28W buck-boost charger — are aimed at devices, such as IoT or mobile phones, that need more power or for fast charging. To shave time off development and cost when changing from single-cell to two-series cell architectures, these are USB-... » read more

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