A Tale of Two Testers


David Tacelli, president and CEO of Xcerra, was excited. His company’s reception for customers (and the press) at the Trou Normand restaurant in San Francisco’s hip South of Market neighborhood was going very well. Gourmet salames and other tasty foods were on offer, along with fine wines and craft ales and beers. He gleefully pointed out to editors that the product to be introduced at t... » read more

The Week In Review: IoT


Tools SAP brought out an Internet of Things tool called the Leonardo IoT Bridge, meant to connect sensor data from the field with business data systems inside enterprises. Leonardo IoT Bridge makes use of the SAP Leonardo cloud-based service. The German software company said it would partner with the Bosch Group to provide an IoT Bridge dashboard for delivery companies, keeping tabs on deliver... » read more

The Future of Testing


In our previous test blog posts, we looked at the history of automated test equipment for semiconductors and for printed circuit boards. This month, we look ahead to the test technologies that are emerging. The chip ATE field has essentially boiled down to Advantest, Teradyne, and Xcerra (LTX-Credence), while the board test market is dominated by Teradyne and Keysight Technologies (formerly ... » read more

Strategic Principles For Securing The Internet Of Things (IoT)


Source: U.S. Department Of Homeland Security. Version 1.0 Dated: 11/15/16 "The growth of network-connected devices, systems, and services comprising the Internet of Things (IoT) creates immense opportunities and benefits for our society. IoT security, however, has not kept up with the rapid pace of innovation and deployment, creating substantial safety and economic risks. This document expla... » read more

Is The IoT Here To Stay?


Look at almost any forecast for the Internet of Things market, and you’ll see some big, impressive numbers. Bain says IoT vendor revenues will top $470 billion by 2020. McKinsey predicts the IoT market will be increasing from last year’s $900 million to $3.7 billion in 2020 for a compound annual growth rate of 32.6%. IHS estimates the number of installed IoT devices will rise from 15.4 bill... » read more

IoT Has Always Been With Us


By most accounts, Kevin Ashton of the Auto-ID Center at the Massachusetts Institute of Technology coined the term “the Internet of Things” in 1999, referring to a system of ubiquitous sensors connecting the Internet with the physical world. We were well into the 21st century before the Internet of Things, as a marketing term or a short description of a certain technology, came to be wide... » read more

The Week In Review: IoT


Analysis Cisco Systems and General Electric will be the main contenders in the industrial Internet of Things market, this analysis contends. Meanwhile, The New York Times analyzes GE’s big bet on the IoT and related software development to stay ahead of competing technology giants. Qualcomm holds the most Internet of Things patents, leading Intel, ZTE, Nokia, and LG Electronics, this anal... » read more

What’s Better than the Internet of Things?


We all like the Internet of Things, whatever that is. Would you be interested in the Innovative and Intelligent Internet of Things? The Semiconductor Research Corporation can get you involved in that project, also known as I3T. “This research enables breakthrough technologies for the next generation of intelligent, connected, and autonomous devices,” the I3T website reads. The program is... » read more

The Grammar Police Have Spoken


The Associated Press has made “internet” its standard spelling for the global collection of interconnected computer networks, previously known as the Internet. And it decreed that “web” would take the place of the Web, as in the World Wide Web, the initials of which are found at the beginning of most website addresses. It’s a style change, as journalists call it, which has been adv... » read more

Keeping The Whole Package Cool


Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but the ability to dissipate the heat depends on the package surface area. Because the goal of 3D packaging is to squeeze more transistors into less overall space, new heat dissipation issues are em... » read more

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