tag: Internet of Things

The Week In Review: IoT
By Jeff Dorsch - 02 Sep, 2016 - Comments: 0

Analysis Cisco Systems and General Electric will be the main contenders in the industrial Internet of Things market, this analysis contends. Meanwhile, The New York Times analyzes GE’s big bet on the IoT and related software development to stay ahead of competing technology giants. Qualcomm holds the most Internet of Things patents, leading Intel, ZTE, Nokia, and LG Electronics, this anal... » read more

What’s Better than the Internet of Things?
By Jeff Dorsch - 01 Sep, 2016 - Comments: 0

We all like the Internet of Things, whatever that is. Would you be interested in the Innovative and Intelligent Internet of Things? The Semiconductor Research Corporation can get you involved in that project, also known as I3T. “This research enables breakthrough technologies for the next generation of intelligent, connected, and autonomous devices,” the I3T website reads. The program is... » read more

The Grammar Police Have Spoken
By Jeff Dorsch - 07 Jul, 2016 - Comments: 0

The Associated Press has made “internet” its standard spelling for the global collection of interconnected computer networks, previously known as the Internet. And it decreed that “web” would take the place of the Web, as in the World Wide Web, the initials of which are found at the beginning of most website addresses. It’s a style change, as journalists call it, which has been adv... » read more

Keeping The Whole Package Cool
By Katherine Derbyshire - 12 May, 2016 - Comments: 0

Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but the ability to dissipate the heat depends on the package surface area. Because the goal of 3D packaging is to squeeze more transistors into less overall space, new heat dissipation issues are em... » read more

Engineering The Internet Of Things
By Ansys - 11 May, 2016 - Comments: 0

All around us connected devices are proliferating. New, innovative products are emerging almost daily, and familiar products are benefiting from newer, smarter functionality. These developments come with the promise of making us healthier and safer, as well as more efficient, innovative, competitive and profitable. The Internet of Things, or IoT, which holds great potential, also presents new c... » read more

Power Integrity Optimization Cuts RF Substrate Noise
By Tobias Bjerregaard - 14 Apr, 2016 - Comments: 0

Our main focus is on dynamic voltage drop at 16-14-10nm and beyond, but the rise of the Internet of Things (IoT) prompted me to share some silicon measurement results that are relevant to the RF design community. Normally, power integrity (PI) is looked at in the time domain, but in this work we looked at it from a frequency spectrum perspective. Silicon measurements prove how shaping the dynam... » read more

Charting A New Course For Semiconductors
By Rambus - 09 Mar, 2016 - Comments: 0

The semiconductor industry is at an inflection point facing challenges, including rising development costs, shrinking margins, market saturation and unprecedented consolidation. Although no stranger to boom and bust cycles, semiconductor companies are actively seeking a return to stability via a more sustainable and collaborative business paradigm. In this context, Rambus and the Global S... » read more

Is Your IoT Network Just Another Playground For Hackers?
By Warren Kurisu - 03 Mar, 2016 - Comments: 0

Let's talk about how the IoT is evolving. Last year, Gartner published a study that said 5.5 million new “things” were being connected to the Internet every day. The study predicts that by the end of this year there will be 6.4 billion connected devices, and by 2020 there will be 20.8 billion connected devices. That’s a lot of connected things to keep track of and to protect fro... » read more

IP Requirements Changing
By Brian Bailey - 25 Feb, 2016 - Comments: 0

Twenty years ago the electronics industry became interested in the notion of formalizing re-use through third-party IP. It has turned out to be harder than anyone imagined. In 1996, the Virtual Socket Interface Alliance ([getentity id="22845" comment="VSIA"]) was formed to standardize the development, distribution and licensing of IP. Soon afterward, companies with a couple of people in a ga... » read more

Executive Insight: Paul Kocher
By Ed Sperling - 04 Feb, 2016 - Comments: 0

Paul Kocher, president and chief scientist of Rambus' Cryptography Research Division, sat down with Semiconductor Engineering to talk about the state of security today and how it will be affected as more devices are connected. What follows are excerpts of that conversation. SE: The number of vulnerabilities is increasing. Are we making progress? Kocher: If your metric for progress is the... » read more

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