tag: IP

System-Level Verification Tackles New Role
By Brian Bailey - 09 Jun, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advances in system-level verification with Larry Melling, product management director for the system verification group of [getentity id="22032" e_name="Cadence"]; Larry Lapides, VP of sales for [getentity id="22036" e_name="Imperas”] and Jean-Marie Brunet, director of marketing for the emulation division of [getentity id="22017" e_name="Mentor Gr... » read more

Executive Insight: Simon Segars
By Ed Sperling - 08 Jun, 2016 - Comments: 1

Simon Segars, CEO of ARM, examines the future of mobile computing, how it intersects with the IoT, why ecosystems are vital, and how computing is evolving. What follows are excerpts of that conversation. SE: Most analysts say the growth rate of mobile is slowing. The big buzz phrase now is Internet of Things. How does ARM's role change with that shift? Segars: Mobile is still changing and... » read more

Alternative To x86, ARM Architectures?
By Jeff Dorsch - 07 Jun, 2016 - Comments: 1

Software developed by professors and graduate students from the University of California at Berkeley? That will never fly in the semiconductor industry, right? Maybe they said that about SPICE, four decades ago. The jury is still out on RISC-V (pronounced risk-five) the modular, open-source instruction set architecture created in this decade by Cal professors and students, yet the ISA is gai... » read more

Executive Insight: Lip-Bu Tan
By Ed Sperling - 06 Jun, 2016 - Comments: 0

Lip-Bu Tan, president and CEO of Cadence, opens up on the next big things, what will drive them, and what will change to make that happen. What follows are excerpts of that conversation. SE: What are the biggest changes in the semiconductor industry over the past year? Tan: The whole system approach to designing hardware and software is really happening now. It will continue to expand fr... » read more

Cooperation Instead Of Competition
By Bill Neifert - 03 Jun, 2016 - Comments: 0

I spent more than 20 years working in EDA and managed to do so without ever working for one of the big three. Big EDA companies were always the competition. Oh sure, you’d partner with them strategically if you could, but always keeping in mind that little fish swimming with big fish often end up being eaten. That all changed seven months ago when ARM acquired Carbon’s technology and tea... » read more

“eNVM Inside” Could Be The Next Catchphrase
By Charlie Cheng - 02 Jun, 2016 - Comments: 0

Let's do a bit of a refresh on embedded non-volatile memory (eNVM) IP and the markets it has ably served: analog/mixed signal, automotive, consumer, industrial and mobile applications. Rather mainstream segments, albeit high value, in need of reliable storage. An estimated 10-billion units shipped in more than 400 chip designs makes eNVM IP a popular choice. See for yourself as we take a ret... » read more

Valtrix Pushes For Horizontal Verification Reuse
By Brian Bailey - 01 Jun, 2016 - Comments: 0

Some of the most significant advances are not the result of a single person or a single idea. They often don’t happen overnight, and are suggested by a change that slowly becomes pervasive enough to become a generalized solution. That is exactly what is happening right now in the area of functional verification. The tools and methodologies in place at the moment assumed designs typical of the... » read more

Preparations for DAC
By Brian Bailey - 27 May, 2016 - Comments: 1

The 53rd DAC is just days away now and the program is pretty well established at this point. It is returning to Austin after a couple of years in San Francisco. In 2013 it was held in this location for the first time and there was a herculean effort to bring the local design community to the event. They did amazing well and while attendance fell slightly compared to the previous year in San Die... » read more

Bulk CMOS Vs. FD-SOI
By Mark LaPedus - 19 May, 2016 - Comments: 2

The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging. Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process... » read more

Bridging the IP Divide
By Brian Bailey - 18 May, 2016 - Comments: 1

IP reuse enabled greater efficiency in the creation of large, complex SoCs, but even after 20 years there are few tools to bridge the divide between the IP provider and the IP user. The problem is that there is an implicit fuzzy contract describing how the IP should be used, what capabilities it provides, and the extent of the verification that has been performed. IP vendors have been trying to... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy