Using Synopsys Z01X To Accelerate The Fault Injection Campaign Of A Fully Configurable IP

By Arteris - 05 Jun, 2019 - Comments: 0

By Arteris IP Alexis Boutillier, Corporate Application Manager, Safety Manager, and Mohan Krishnareddy, Solution Engineer, at the Synopsys Users Group (SNUG), March 2018, Santa Clara, CA. Principles and real-world practices of ISO 26262 for semiconductor design teams. After providing an overview of how functional safety affects management, development, and supporting processes, the paper exp... » read more

Why IP Quality Is So Difficult To Determine

By Ann Mutschler - 30 May, 2019 - Comments: 0

Differentiating good IP from mediocre or bad IP is getting more difficult, in part because it depends up on how and where it is used and in part because even the best IP may work better in one system than another—even in chips developed by the same vendor. This has been one of the challenges with IP over the years. In many cases, IP is poorly characterized, regardless of whether that IP wa... » read more

Analog Fault Simulation

By Ed Sperling - 30 May, 2019 - Comments: 0

Anand Thiruvengadam, senior staff product marketing manager at Synopsys, drills down into the need for fault simulation in analog circuits in automotive designs. » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 10 May, 2019 - Comments: 0

Internet of Things Microsoft this week introduced IoT Plug and Play, a no-code toolkit for connecting Internet of Things devices to the cloud. The company touts it as a new modeling language to pump up the capabilities of IoT devices through the Microsoft Azure cloud service. The Azure IoT Device Catalog lists devices that support IoT Plug and Play, such as the STMicroelectronics SensorTile.bo... » read more

FPGA Implementation Tools

By Synopsys - 08 May, 2019 - Comments: 0

Advances in design and manufacturing technology allow increased factory automation, where tasks are automatically performed by sophisticated equipment such as industrial robots. Manufacturing processes require fail-safe mechanisms to prevent human injury or costly downtime. With increasing sophistication and automation of the manufacturing processes, there is increasing need for error detection... » read more

Meeting ISO 26262 Requirements Using Tessent IC Test Solutions

By Mentor, a Siemens Business - 07 May, 2019 - Comments: 0

As the industry moves towards greater automation in vehicles, suppliers of the ICs used to drive the automotive electronic systems are rapidly adopting solutions to meet ISO 26262 requirements. The Tessent family of IC test products offers the highest defect coverage, in-system non-destructive memory test, hybrid ATPG/Logic BIST, and analog test coverage measurement. These technologies add up t... » read more

Road Not Fully Constructed

By Ed Sperling - 02 May, 2019 - Comments: 3

There is a growing consensus in the semiconductor industry that SAE Level 3 and Level 4 autonomy will be full of unexpected hazards. At a number of recent conferences in Silicon Valley, experts from all parts of the semiconductor industry have voiced concern about those middle steps between assisted driving and full autonomy. This isn't the public position taken by carmakers and Tier 1s.... » read more

When Verification Leads

By Brian Bailey - 25 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the implications of having an executable specification that drives verification with Hagai Arbel, CEO for VTool; Adnan Hamid, CEO for Breker Verification; Mark Olen, product marketing manager for Mentor, a Siemens Business; Jim Hogan, managing partner of Vista Ventures; Sharon Rosenberg, senior solutions architect for Cadence Design Systems; and Tom... » read more

Racing To The Edge

By Susan Rambo And Ed Sperling - 09 Apr, 2019 - Comments: 0

The race is on to win a piece of the edge, despite the fact that there is no consistent definition of where the edge begins and ends or how the various pieces will be integrated or ultimately tested. The edge concept originated with the Internet of Things, where the initial idea was that tens of billions of dumb sensors would communicate through gateways to the cloud. That idea persisted unt... » read more

The Long And Detailed Road To Automotive Compliance

By Ann Mutschler - 04 Apr, 2019 - Comments: 0

Compliance with automotive safety requirements is slowing down both innovation and participation by a flurry of startups as the whole ecosystem struggles to bring autonomous vehicles to reality. This is particularly onerous for chipmakers, which face a high bar for IC integrity and reliability. They must meet specifications and be free of design errors. Improper behavior in corner-case s... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ISO 26262