Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 23 Dec, 2021 - Comments: 0

NASA plans to launch the James Webb Space Telescope (JWST) this Saturday, Dec 25, on an European Space Agency (ESA) rocket. Mission-critical radiation-hardened components from IR HiRel, an Infineon company, will go up with the JWST. IR HiRel space-grade DC-DC converters, rad hard MOSFETs and other power control products are in the spacecraft bus subsystems, such as electrical power, altitude co... » read more

Deep Space Design Considerations

By Nicolas Williams - 28 Apr, 2016 - Comments: 0

The linchpin technology in a deep space telescope is the ability to efficiently convert analog image sensor data into digital data in order to beam home high-resolution images of astronomical objects. The analog-to-digital converters (ADC) must perform flawlessly once deployed, because it is not feasible to drive out 1 million miles into space to fix any problems. The next-generation success... » read more

Analog-To-Digital Conversion Is Key For Deep Space Exploration With The James Webb Space Telescope

By Mentor, a Siemens Business - 27 Apr, 2016 - Comments: 0

Reflect back to your last design project. Did it have leading-edge requirements that seemed impossible at the time to fulfill? Now think about a design that needs to live in the harsh environment of space. A device that has to sip power and function flawlessly for over a decade because there is no opportunity to service it if anything goes wrong. That is the set of requirements that faced Dr. L... » read more

Manufacturing Bits: Dec. 10

By Mark LaPedus - 10 Dec, 2013 - Comments: 0

Space Telescopes The James Webb Space Telescope, the follow-on mission to the Hubble Space Telescope, is a large, infrared-optimized space telescope. Slated for a launch date of 2018, Webb will find the first galaxies that were formed in the early Universe. Webb is a collaboration between NASA, the European Space Agency (ESA) and the Canadian Space Agency (CSA). Webb’s measurements will ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: James Webb Space Telescope

Week In Review: Auto, Security, Pervasive Computing

Deep Space Design Considerations

Analog-To-Digital Conversion Is Key For Deep Space Exploration With The James Webb Space Telescope

Manufacturing Bits: Dec. 10