Multi-beam Sees The Light

By Mark LaPedus - 19 Jun, 2014 - Comments: 2

The multiple-beam electron-beam market is going in two separate directions at once. Multi-beam for photomask writing is set to take off. The other market--multi-beam for direct-write lithography applications—is still in the early stages and remains in flux. In the multi-beam direct-write segment, for example, multiple sources indicate that KLA-Tencor is exiting this market to focus on its ... » read more

Multi-Beam Begins To Shine

By Mark LaPedus - 17 Oct, 2013 - Comments: 0

After years of R&D and promises, multi-beam electron-beam technology is delayed and late to the market. The technology requires more funding and work than previously thought. And generally, the skepticism is running high for the technology. Finally, however, there is a ray of hope, and some momentum, in multi-beam—at least on the photomask front. Seeking to accelerate its multi-beam te... » read more

The Week In Review: Sept. 9

By Mark LaPedus - 09 Sep, 2013 - Comments: 0

By Mark LaPedus SK Hynix’ DRAM fab in China caught on fire. The fire caused one minor injury, but it did not impact the equipment, according to reports. SK Hynix will re-open the fab soon, according to reports. Bob Halliday, Applied Materials’ CFO, gave a presentation at an analyst event, saying: “I think there’s probably more technology inflections going on right now than in years.... » read more

Beam Me Up

By Ed Sperling - 18 Oct, 2012 - Comments: 0

By Mark LaPedus For years, electron-beam tools have been struggling to keep up with photomask complexity, causing an alarming increase in write times and mask production costs. Intel and others recently warned that e-beams soon could reach their fundamental limits, thereby requiring the need for new solutions. And in the multiple patterning era, mask makers could see their capital costs soa... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

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Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Megafabs churning out the most advanced processors are not the only game in town.

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tag: JEOL

Multi-beam Sees The Light

Multi-Beam Begins To Shine

The Week In Review: Sept. 9

Beam Me Up