Testing PCI Express 5.0 PHY Transmitter Performance Without Analysis Software


PCI Express (PCIe) 5.0 silicon characterization across process, voltage, and temperature variations, is necessary for accelerating SoC designs. To measure key qualifying parameters, designers and test engineers must have a good understanding of the PCIe 5.0 base electrical specification and know the physical layer’s design architecture and features for accurate characterization of 32GT/s PHY ... » read more

Power Supply Noise Effects On Jitter In Clock Synchronous Systems With Emphasis On Memory Interfaces


In today's fast-paced digital world, the performance and capacity of high-speed memory has become crucial for a wide range of applications, from personal computing devices to data centers and high-performance computing systems. Designers face challenges in optimizing their designs for speed, power efficiency, and reliability — all while ensuring robustness in the face of power supply noise. T... » read more

Power Supply Noise Effects On Jitter In Clock Synchronous Systems With Emphasis On Memory Interfaces


Power Supply Noise Effects on Jitter in Clock Synchronous Systems with Emphasis on LPDDR5X, DDR5 and HBM3 In today's fast-paced digital world, the performance and capacity of high-speed memory has become crucial for a wide range of applications, from personal computing devices to data centers and high-performance computing systems. Designers face challenges in optimizing their designs ... » read more

Jitter Budgeting For Clock Distribution Networks In High-Speed PHYs And SerDes


This paper presents a simple but practically precise estimation of periodic single-tone power supply induced jitter (PSIJ) for MOS clock buffer chains. The estimation is algebraically simple for its analytical closed-form expression requiring only a few circuit simulation results without the pre-knowledge of circuit device SPICE parameters. The expression is well suited to predict period PSIJ, ... » read more

Dynamic CDC Jitter For Clock Domain Crossing (CDC) Signoff


By Himanshu Bhatt and Paras Mal Jain Detecting and debugging deep sequential CDC convergences using structural CDC verification is extremely difficult since doing a flat analysis on large designs has capacity related challenges, and even if verification tools can complete the analysis, it becomes a nightmare to debug the violations with complex sequential logic. Thus arises the need for dyna... » read more

Wrestling With High-Speed SerDes


SerDes has emerged as the primary solution in chips where there is a need for fast data movement and limited I/O, but this technology is becoming significantly more challenging to work with as speeds continue to rise to offset the massive increase in data. A Serializer/Deserializer is used to convert parallel data into serial data, allowing designers to speed up data communication without h... » read more

Engineering The Signal For GDDR6


DDR1 through DDR3 had their challenges, but speeds were below one gigabit and signal integrity (SI) challenges were more centered around static timing and running pseudo random binary sequence (PRBS) simulations. Now, with GDDR6, we are working on 16 to 20 gigabits per second (Gbps) signaling and even faster in the near future. As a result, engineering the signal for GDDR6 will require careful ... » read more

Symptoms Of SoC Electromagnetic (EM) Crosstalk


By Anand Raman and Magdy Abadir Have you ever had your silicon demonstrate unexpected behavior? Have you ever found unexplainable design failure or performance degradation? A number of issues could be the culprit - from overloaded signal nets, a noisy power grid, or increasing temperature - but one problem often overlooked is electromagnetic (EM) crosstalk. Electromagnetic (EM) crosstal... » read more

Noise Abatement


[getkc id="285" kc_name="Noise"] is a fact of life. Almost everything we do creates noise as a by-product and quite often what is a signal to one party is noise to another. Noise cannot be eliminated. It must be managed. But is noise becoming a larger issue in chips as the technology nodes get smaller and packaging becomes more complex? For some, the answer is a very strong yes, while for ot... » read more