Chip Industry Week in Review

By The SE Staff - 03 Jan, 2025 - Comments: 0

Lawrence Livermore National Laboratory is ramping up R&D for next-gen EUV and plasma-based particle sources, aiming to increase the EUV laser source power by an order of magnitude while also making it more energy-efficient. Specifically, the goal is to replace today's CO2-based laser with a solid-state laser, using a thulium-doped yttrium lithium fluoride medium to increase the laser's powe... » read more

Chip Industry Technical Paper Roundup: Dec. 23

By Linda Christensen - 23 Dec, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=394 /] Find all technical papers here. » read more

Fully Partitioned Security Monitoring Logic From Both The CPU’s Main Core and Privileged SW (KAIST)

By Technical Paper Link - 20 Dec, 2024 - Comments: 0

A new technical paper titled "Interstellar: Fully Partitioned and Efficient Security Monitoring Hardware Near a Processor Core for Protecting Systems against Attacks on Privileged Software" was published by researchers at KAIST. The paper states "The existing approaches to instruction trace-based security monitoring hardware are dependent on the privileged software, which presents a signific... » read more

Baby Steps Toward 3D DRAM

By Bryon Moyer - 17 Dec, 2024 - Comments: 0

Flash memory has made incredible capacity strides thanks to monolithic 3D processing enabled by the stacking of more than 200 layers, which is on its way to 1.000 layers in future generations.[1] But the equally important DRAM has achieved a similar manufacturable 3D architecture. The need for a sufficiently large means of storing charge — such as a capacitor — has proved elusive. Severa... » read more

HBM Options Increase As AI Demand Soars

By Laura Peters - 21 Nov, 2024 - Comments: 0

High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI accelerators, graphic processing units, and high-performance computing applications continues to explode. HBM inventories are sold out, driven by massive efforts and investments in developing and improving large language models such as ChatGPT. HBM is the memory of ch... » read more

New Tradeoffs In Leading-Edge Chip Design

By Katherine Derbyshire - 21 Nov, 2024 - Comments: 0

Device design begins with the anticipated workload. What is it actually supposed to do? What resources — computational units, memory, sensors — are available? Answering these questions and developing the functional architecture are the first steps in a new design — well before committing it to silicon, said Tim Kogel, senior director of technical product management at Synopsys. Yet eve... » read more

Chip Industry Week In Review

By The SE Staff - 15 Nov, 2024 - Comments: 0

CSIS issued a new report that says Intel is "not too big to fail, but too good to lose." The report noted that Intel is needed for national security, and that it must be viewed in a geopolitical context rather than from a purely business standpoint when it comes to funding the company. Japan's government is creating a 10 trillion yen (~$65 billion) fund for next-gen technologies, including A... » read more

Chip Industry Technical Paper Roundup: Oct. 29

By Linda Christensen - 29 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=375 /] More Reading Chip Industry Week In Review Intel’s EU court win; high-NA benchmarks and new maskless litho; SiC down, GaN up; Natcast’s plan; Xiaomi’s 3nm chip; semi tax credit rules; RISC-V; lithium mine; AI-edge expansion. Technical Paper Library home » read more

Characterizing Defects Inside Hexagonal Boron Nitride (KAIST, NYU, et al.)

By Technical Paper Link - 23 Oct, 2024 - Comments: 0

A new technical paper titled "Characterizing Defects Inside Hexagonal Boron Nitride Using Random Telegraph Signals in van der Waals 2D Transistors" was published by researchers at KAIST, NYU, Brookhaven National Laboratory, and National Institute for Materials Science. Abstract: "Single-crystal hexagonal boron nitride (hBN) is used extensively in many two-dimensional electronic and quantu... » read more

Chip Industry Week In Review

By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

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tag: KAIST

Chip Industry Week in Review

Chip Industry Technical Paper Roundup: Dec. 23

Fully Partitioned Security Monitoring Logic From Both The CPU’s Main Core and Privileged SW (KAIST)

Baby Steps Toward 3D DRAM

HBM Options Increase As AI Demand Soars

New Tradeoffs In Leading-Edge Chip Design

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: Oct. 29

Characterizing Defects Inside Hexagonal Boron Nitride (KAIST, NYU, et al.)

Chip Industry Week In Review

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