Blog Review: July 2


Synopsys’ Shankar Krishnamoorthy chats with industry experts about how the combination of AI and software-defined systems is driving a re-evaluation of engineering workflows and why chip, software, and system development must evolve in unison. Siemens’ Jake Wiltgen considers the rapidly evolving and growing challenge of performing DFT verification as designs scale, with complex hierarchi... » read more

Democratizing Design: How The CHIPS Act Is Reshaping EDA And Semiconductor Innovation


After 26 years in the electronics industry, I've witnessed countless technological shifts, but few have been as transformative — or as promising — as what we're experiencing with the CHIPS Act. I spoke at a recent 62nd DAC panel discussion alongside industry colleagues Saverio Fazzari from Booz Allen Hamilton and Vivek Prasad from a non-profit organization established to operate the Nationa... » read more

Mixed Messages Complicate Mixed-Signal


Several years ago, analog and mixed signal (AMS) content hit a wall. Its contribution to first-time chip failure doubled, and there is no evidence that anything has improved dramatically since then. Some see that the problem is likely to get worse due to issues associated with advanced nodes, while others see hope for improvement coming from AI or chiplets. Fig. 1: Cause of ASIC respins. S... » read more

Blog Review: June 25


Siemens’ John McMillan provides a detailed overview of 3D-IC technology and heterogeneous integration, from the market trends driving its adoption to the design, verification, and manufacturing challenges involved. Synopsys’ Gunnar Braun and Stewart Williams check out how cloud-based development practices and virtual prototypes can enable earlier and more efficient testing and validation... » read more

Design and Test Solutions for E-Mobility and Autonomous Driving


The automotive industry is accelerating its electronic technology revolution and fusing with the clean energy ecosystem. By 2030, 4.2 million cars will be autonomous and 50% will be electric. Dramatic increases in the number of sensors and applications in new automobiles have evolved the vehicle from a peripheral role to a network hosting clusters of connected devices. Cars now need to be o... » read more

EDA’s Top Execs Map Out An AI-Driven Future


Artificial intelligence is permeating the entire semiconductor ecosystem, forcing fundamental changes in AI chips, the design tools used to create them, and the methodologies used to ensure they will work reliably. This is a global race that will redefine nearly every domain over the next decade. In presentations and interviews over the past several months, top EDA executives converged on th... » read more

Chip Industry Week in Review


Texas Instruments will invest more than $60 billion to build and expand seven semiconductor fabs in Texas and Utah, supporting more than 60,000 U.S. jobs. Chinese automakers — including SAIC Motor, Changan, Great Wall Motor, BYD, Li Auto and Geely — are aiming to launch new models with 100% homemade chips, some as early as 2026, reports Nikkei Asia. Marvell introduced 2nm custom SRAM ... » read more

Can You Build A Known-Good Multi-Die System?


Semiconductor Engineering sat down to discuss the challenges of designing and testing multi-die systems, including how to ensure they will work as expected, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadenc... » read more

Blog Review: June 18


Synopsys’ John Koeter and other industry experts discuss whether high-bandwidth memory should follow established standards for broad compatibility and scalability or be customized to address specific use case requirements and time-to-market targets. In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about how progress in 3D-IC development, thermal management, and the indu... » read more

Chip Industry Week in Review


Qualcomm announced plans to buy Alphawave Semi for ~$2.4 billion in a deal expected to close in Q1 2026. Qualcomm plans to leverage Alphawave Semi's connectivity products, including chiplets, to develop high-performance, low-power solutions for AI inferencing and customized CPUs in data centers. Qualcomm's traditional targets were mobile phones and edge computing. [Updated 6/9.] Global semic... » read more

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