Chip Industry Week In Review


Chinese startup DeepSeek rattled the tech world and U.S. stock market with claims it spent just $5.6 million on compute power for its AI model compared to its billion-dollar rivals in the U.S. The announcement raised questions about U.S. investment strategies in AI infrastructure and led to an initial $600 billion selloff of NVIDIA stock. Since its launch, DeepSeek reportedly was hit by malicio... » read more

Chip Architectures Becoming Much More Complex With Chiplets


The migration from monolithic SoCs to chiplet-based designs is creating a confusing array of options and tradeoffs for design teams working at the leading edge, and the number of choices is only going to increase as third-party chiplets begin pouring into the market. That hasn't dampened the appetite for chiplets, however, which are deemed essential for future generations of semiconductors f... » read more

Gold In The Machine: Scaling Infrastructure For The Age Of AI


During the gold rush, hopeful prospectors flooded the west to make their fortunes in gold. Today, technology pioneers are looking to stake their claim in the realm of artificial intelligence (AI). Price Waterhouse Cooper (PWC) estimates that 45% of total global economic gains by 2030 will be driven by AI as more sectors embrace the productivity and product enhancement benefits of AI. PWC’s ... » read more

Blog Review: Jan. 29


Cadence's Reela Samuel looks beyond silicon to new semiconductor materials under development and the particular applications for gallium nitride, silicon carbide, indium phosphide, glass, and diamond. Siemens' Kyle Fraunfelter and Melville Bryant find that lean approaches alone cannot address the increasingly complex sustainability challenges of semiconductor manufacturing and call for the e... » read more

The Digital Twin Technology Applied to 6G Communication


This paper provides a comprehensive overview of digital twin technology, starting with its definition as a dynamic virtual representation of physical systems. Furthermore, we distinguish between simulators and digital twins, highlighting their key differences and characteristics particularly related to the interactions with real-time data. The paper also delves into the evolution of digital ... » read more

What IoMT Really Stands For


The basic goals of engineering include the achievement of a product’s purpose, safety, cost, manufacturability, and supportability, among other things. For internet of things (IoT) applications, much of the essential purpose relates to wireless communications that untether communication from wires and cables. This is especially true of the rapidly growing internet of medical things (IoMT), wh... » read more

Chip Industry Week In Review


The new Trump administration was quick to put a different stamp on the tech world: President Trump rescinded a long list of Biden’s executive orders, including those aimed at AI safety and the mandate for 50% EVs by 2030. Roughly 1.3 million EVs were sold in the U.S. in 2024, up 7.3% from 2023. The new administration announced $500 billion ($100 billion initially) in private sector in... » read more

Blog Review: Jan. 22


Cadence's David Shin provides an overview of the eUSB2V2 specification, which scales up to 4.8Gbps of data rate and provides the flexibility to configure either asymmetrical or symmetrical links depending on the intended application. Siemens EDA's Spencer Acain highlights the key role of AI in semiconductor testing, including the addition of analytical AI in DFT tools and how applying machin... » read more

Chip Industry Week In Review


GlobalFoundries will create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. A flurry of announcements on advanced semiconductors and AI rolled out this week as U.S. President Biden wrapped up his term: The Biden-Harris Administration released an Interim Final Rule on Artificial Intelligence Diffusion to strengthen ... » read more

2025: So Many Possibilities


The stage is set for a year of innovation in the chip industry, unlike anything seen for decades, but what makes this period of advancement truly unique is the need to focus on physics and real design skills. Planar scaling of SoCs enabled design and verification tools and methodologies to mature on a relatively linear path, but the last few years have created an environment for more radical... » read more

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