The True Cost Of CMMC Non-Compliance


If you’re in the Defense Industrial Base (DIB), you’ve probably felt the shift: cybersecurity has moved from a contractual footnote to a deciding factor in who gets to compete. The Cybersecurity Maturity Model Certification (CMMC) is the clearest signal yet that the Department of Defense (DoD) is moving away from “trust us” security and toward verified compliance. And in the face of ... » read more

The Power of Proof: Turning CMMC Compliance into Competitive Credibility


To help the U.S. Defense Industrial Base (DIB) navigate the path to Cybersecurity Maturity Model Certification (CMMC), Keysight Technologies commissioned SIS International Research to conduct an independent, multi-phase study evaluating cybersecurity readiness among contractors, subcontractors, and suppliers. The research combines a thorough review of regulatory frameworks and market structures... » read more

Blog Review: Feb. 4


Siemens' Tova Levy examines thermal management in 3D-IC, including why heat behaves differently in vertical stacks and how to analyze and manage thermal risk earlier and more predictably to ensure a design can meet performance, reliability, and time-to-market targets. Cadence's Reela Samuel finds that known-good-die strategies, standardized die-to-die test access, and vertical reliability mo... » read more

How The EDA Industry Will Evolve In 2026


AI will continue to impact every facet of the EDA industry. Pressure will mount in 2026 on design teams to drive productivity gains while technical complexity continues to escalate. This will reshape how teams work and the tools they use. Success will be determined by balancing the trade-offs between integrated platforms and best-of-breed toolchains and developing talent internally rather than ... » read more

Multi-Die Assemblies Require More Detailed Test Plan Earlier


Key Takeaways Design for test takes on new urgency in complex multi-die assemblies, where it can be used to minimize downstream errors and the cost of fixing them. DFT needs to be increasingly detailed due to more connections and the inability to access some components. DFT strategies need to be developed earlier and may require multiple testing approaches. Multi-die assembl... » read more

AI’s Impact On Engineering Jobs May Be Different Than Expected


Key Takeaways: AI is expected to eliminate many repetitive, entry-level tasks, but that may allow engineering students trained on the latest tools to start in more senior positions. AI is a force multiplier. It can accelerate the learning curve for junior engineers. While AI is very good at solving multi-dimensional problems, domain expertise, critical thinking, and sanity checks wil... » read more

The Next-Generation of Circuit Simulation in RF EDA


Radio-Frequency (RF) Electronic Design Automation (EDA) is at a turning point. Historically, engineers adapted their workflows to rigid software tools, often sacrificing flexibility and efficiency. With the rise of increasingly complex, multi-domain hardware systems, these constraints are no longer sustainable. Keysight is reimagining RF simulation as a programmatically controlled, extensible p... » read more

Blog Review: Jan. 28


Synopsys' Dana Neustadter and Vincent van der Leest argue that a hardware-based approach to security is required to fully address the risks introduced by modern AI architectures and the distributed workloads they support. Siemens EDA's Tova Levy examines multiphysics challenges in 3D-IC designs and outlines three design imperatives to identify risks earlier and support PPA, reliability, and ... » read more

Chip Industry Week In Review


TSMC is expected to reduce its Fab 14 mature-node capacity by 15% to 20% to free up resources for its advanced packaging technologies, reports Counterpoint. The foundry will likely rely on its VIS affiliate site in Singapore (operational in late 2026) and other overseas fabs to ensure continued supply for older nodes. Memory The U.S. threatened 100% tariffs on South Korean memory compan... » read more

Blog Review: Jan. 21


Keysight's Armando Valim considers the impact of AI on the memory market as AI infrastructure pressure widens the gap between high-performance memory and lower-margin consumer memory and SSD, forcing manufacturers to make strategic decisions and define which markets to serve. Cadence's Reela Samuel breaks down the major 3D-IC packaging methods used today, from wafer stacking flows to hybrid ... » read more

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