tag: KLA

Next-Gen 3D Chip/Packaging Race Begins
By Mark LaPedus - 31 Jan, 2022 - Comments: 5

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the first vendor to unveil chips using copper hybrid bonding, an advanced die-stacking technology that enables next-generation 3D-like devices and packages. Hybrid bonding stacks and connects chips usin... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Jan, 2022 - Comments: 0

Government policy As reported, the United States is in dire need of more fab capacity as well as packaging plants. The U.S. took a big step in an effort to solve the problem. The U.S. House of Representatives this week introduced the America Competes Act of 2022. The bill includes funding for the Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act, which is earmarked... » read more

200mm Shortages May Persist For Years
By Mark LaPedus - 20 Jan, 2022 - Comments: 2

A surge in demand for chips at more mature process nodes is causing shortages for both 200mm foundry capacity and 200mm equipment, and it shows no signs of letting up. In fact, even with new capacity coming on line this year, shortages are likely to persist for years, driving up prices and forcing significant changes across the semiconductor supply chain. Shortages for both 200mm foundry cap... » read more

The Gargantuan 5G Chip Challenge
By Ed Sperling - 11 Jan, 2022 - Comments: 0

Blazing fast upload and download speeds for cellular data are coming, but making the technology function as expected throughout its expected lifetime is an enormous challenge that will require substantial changes across the entire chip ecosystem. While sub-6GHz is an evolutionary step from 4G LTE, the real promise of 5G kicks in with millimeter-wave (mmWave) technology. But these higher-freq... » read more

Inspecting And Testing GaN Power Semis
By Patrick Waurzyniak - 11 Jan, 2022 - Comments: 1

As demand for new automotive battery electric vehicles (BEVs) heats up, automakers are looking for solutions to meet strict zero-defect goals in power semiconductors. Gallium nitride (GaN) and silicon carbide (SiC) wide-bandgap power semiconductors offer automakers a range of new EV solutions, but questions remain on how to meet the stringent quality goals of the automotive industry. Among t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Dec, 2021 - Comments: 0

Chipmakers Chip investments in Malaysia got a shot in the arm this week. First, Intel has announced plans to invest more than RM30 billion, or US$7 billion, within its Malaysian packaging and test facilities. The additional investment will help expand Intel Malaysia’s operations across Penang and Kulim. This new investment is expected to create over 4,000 Intel jobs as well as over 5,000 con... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 17 Dec, 2021 - Comments: 0

Automotive Features of Toyota’s key fobs for entering vehicles get turned off when drivers do not start paying a subscription fee when the complementary subscriptions end, says an article in Ars Technica. SiLC Technologies announced its compact Eyeonic Vision Sensor, a FMCW lidar sensor, is now commercially available. The sensor has a silicon photonic chip that keeps a lidar’s size down... » read more

Using Manufacturing Data To Boost Reliability
By Ed Sperling and Ann Mutschler - 07 Dec, 2021 - Comments: 0

As chipmakers turn to increasingly customized and complex heterogeneous designs to boost performance per watt, they also are demanding lower defectivity and higher yields to help offset the rising design and manufacturing costs. Solving those issues is a mammoth multi-vendor effort. There can be hundreds of process steps in fabs and packaging houses. And as feature sizes continue to shrink, ... » read more

Big Payback For Combining Different Types Of Fab Data
By Anne Meixner - 07 Dec, 2021 - Comments: 1

Collecting and combining diverse data types from different manufacturing processes can play a significant role in improving semiconductor yield, quality, and reliability, but making that happen requires integrating deep domain expertise from various different process steps and sifting through huge volumes of data scattered across a global supply chain. The semiconductor manufacturing IC data... » read more

Engineers’ Experiences Around The World
By Ben Tsai - 07 Dec, 2021 - Comments: 0

As CTO, I see my role partially as strengthening the engineering community through program reviews, engineering education programs, conferences, seminars, and the product life cycle process at KLA. I also think it is critically important to spark engineering enthusiasm – helping engineers rediscover the excitement and curiosity that helps drive innovation. When inspired to create, engineers c... » read more

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