tag: Lam Research

Fab Investments Head Toward Record High
By Marie C. Baca - 27 Jul, 2022 - Comments: 0

Corporations and governments around the globe are making record-breaking investments in chip manufacturing plants amid a major push to make the semiconductor supply chain more robust and less prone to shortages caused by everything from market variations to geopolitical interruptions. These investments — which range from updating existing fabrication facilities to building entirely new fab... » read more

How Quickly Can SiC Ramp?
By Adele Hars - 21 Jul, 2022 - Comments: 0

Device makers across the globe are ramping silicon carbide (SiC) manufacturing, with growth set to really take off starting in 2024. It’s been almost five years since Tesla and STMicroelectronics threw down the gauntlet with SiC in the Model 3. Now, no one doubts the market pull for electric vehicles, but consumers are still clamoring for better range and faster charging. SiC devices are a... » read more

Hybrid Bonding Moves Into The Fast Lane
By Laura Peters - 21 Jul, 2022 - Comments: 1

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid bonding has become an essential component in that equation. Hybrid bonding involves die-to-wafer or wafer-to-wafer connection of copper pads that carry power and signals and the surrounding diele... » read more

Radio Frequency Filters For 5G: What They Are And Why They’re Worth The Trouble
By David Haynes - 21 Jul, 2022 - Comments: 0

By David Haynes, Daniel Shin, and Lidia Vereen­ In the recent blog article "Our wireless world – how Wi-Fi 6 will seamlessly integrate with 5G to keep us connected," David Haynes from our Customer Support Business Group (CSBG) explained how this new generation of wireless technologies will improve our connectivity by using higher frequencies and greater bandwidth than current 4G and Wi-F... » read more

Blog Review: July 20
By Jesse Allen - 20 Jul, 2022 - Comments: 0

Synopsys' Ron Lowman examines the various neural networks used in camera applications, the balancing act between camera lens choice and neural networks implemented, and how IP and embedded vision processors help optimize the designs. Siemens' Katie Tormala considers the importance of acoustic performance in consumer electronics and why it's important to understand the relationships between t... » read more

Week in Review: Manufacturing, Test
By Karen Heyman - 15 Jul, 2022 - Comments: 0

Fab capacity STMicroelectronics and GlobalFoundries inked a deal to build a new jointly-operated 300mm fab adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300mm wafer per year production at full build-out (~42% ST and ~58% GF). The new facility will support several technologies, with a special focus... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 15 Jul, 2022 - Comments: 0

Automotive, mobility The head of Tesla’s Autopilot division — Andrej Karpathy — resigned from the company after Tesla laid off 200 people in its Autopilot division and the U.S. National Highway Transportation Safety Administration broadened its safety investigation of Tesla’s Autopilot. The NHTSA last month broadened its August 2021 investigation, which was looking at why Tesla cars on... » read more

Research Bits: July 11
By Jesse Allen - 11 Jul, 2022 - Comments: 0

Modeling ALE Scientists at U.S. Department of Energy’s (DOE) Princeton Plasma Physics Laboratory (PPPL), in coordination with Lam Research, modeled atomic layer etching (ALE) for semiconductor fabrication. “This would be one little piece in the whole process,” said David Graves, associate laboratory director for low-temperature plasma surface interactions at PPPL and a professor in th... » read more

Week In Review, Manufacturing, Test
By Karen Heyman - 01 Jul, 2022 - Comments: 0

Samsung announced initial production of its 3nm process node, which uses a gate-all-around (nanosheet) transistor structure that the company calls Multi-Bridge-Channel FET (MBCFET). The first-generation 3nm process can reduce power consumption by up to 45% compared with a 5nm process, as well as improve performance by 23% and reduce area by 16%, according to the company. The second-generation 3... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 17 Jun, 2022 - Comments: 0

Node scaling wars are revving up, although much of the action is happening where most people can't see it — inside of research labs. This is difficult stuff, which makes delivery dates difficult to pinpoint, and no one wants to give away their competitive position or commit to a timeline they can't keep. Billions of dollars of leading-edge research — funded by pure-play foundry TSMC, IDM... » read more

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