tag: Lam Research

Inspecting, Testing, And Measuring SiC
By Patrick Waurzyniak - 12 Oct, 2021 - Comments: 0

Achieving the auto industry's stringent zero defect goals is becoming a big challenge for makers of silicon carbide substrates, which are struggling to achieve sufficient yields and reliability as they migrate from 150mm to 200mm wafers and shift their focus away from pure silicon. SiC is a combination of silicon and harder carbide materials, and it has emerged as a key technology for batter... » read more

Gearing Up For Next-Gen Power Semis
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

After years in R&D, several vendors are moving closer to shipping power semiconductors and other products based on next-generation wide-bandgap technologies. These devices leverage the properties of new materials, such as aluminum nitride, diamond, and gallium oxide, and they are also utilized in different structures, such as vertical gallium-nitride power devices. But while many of thes... » read more

What’s Changing In DRAM
By Ed Sperling - 15 Sep, 2021 - Comments: 0

Most of the attention in chip scaling has been focused on logic and on-chip memory, but off-chip memory is starting to encounter problems, as well. David Fried, vice president of computational products at Lam Research, looks at the impact of shrinking features and increasing density, including variation, thermal effects and aging, as well as effects such as micro-loading and DRAM stacking. » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Sep, 2021 - Comments: 0

Chipmakers, OEMs Intel plans to establish foundry capacity at its fab in Ireland. The company has also launched the so-called Intel Foundry Services Accelerator to help automotive chip designers transition from mature to advanced nodes. The company is setting up a new design team and offering both custom and industry-standard intellectual property (IP) to support the needs of automotive custom... » read more

Making Test Transparent With Better Data
By Susan Rambo - 07 Sep, 2021 - Comments: 0

Data is critical for a variety of processes inside the fab. The challenge is getting enough consistent data from different equipment and then plugging it back into the design, manufacturing, and test flows to quickly improve the process and uncover hard-to-find defective die. Progress is being made. The inspection and test industry is on the cusp of having more dynamic ways to access the dat... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Aug, 2021 - Comments: 0

Chipmakers, OEMs Reports have surfaced that TSMC has delayed its 3nm process. But TSMC says the technology remains on track. Volume production for TSMC’s 3nm is still scheduled for the second half of 2022. On the flip side, there is speculation that TSMC may increase its wafer prices by up to 20%, according to a report from the Taipei Times. Here's another report. This is due to chip shortag... » read more

Angstrom-Level Measurements With AFMs
By Mark LaPedus - 19 Aug, 2021 - Comments: 0

Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0... » read more

Specialty Technologies Bring New Functionality
By David Haynes - 19 Aug, 2021 - Comments: 0

As a materials engineer, I am very proud of the fact that key advances in human civilization have been driven by materials innovation. The stone age, bronze age, and iron age were all essential steps in setting the human race on the path that we are on today. Innovations are not without their downsides, but they have enabled progress in agriculture, medicine, transportation, communication, a... » read more

Blog Review: Aug. 11
By Jesse Allen - 11 Aug, 2021 - Comments: 0

Arm's Rahul Mathur finds that traditional interconnects have become a bottleneck for improving IC performance and suggests buried interconnects as a way to lower signal routing delay. Cadence's Paul McLellan checks out forksheet FETs, a new transistor type that could allow scaling past 3nm, and the interconnect advances that will need to accompany it. A Synopsys writer explains the new LP... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Aug, 2021 - Comments: 0

Chipmakers Taiwan’s Foxconn continues to expand its efforts in the semiconductor business. Foxconn has acquired a 6-inch wafer fab and the equipment from Taiwan’s Macronix for NT$2.52 billion (US$90.76 million). With the fab, Foxconn plans to enter the wideband gap semiconductor market, namely silicon carbide (SiC). SiC devices are used in electric vehicles, a market that Foxconn is making... » read more

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