tag: Lawrence Berkeley National Laboratory

Research Bits: Sept. 24
By Jesse Allen - 24 Sep, 2024 - Comments: 0

Modeling negative capacitance Researchers from Lawrence Berkeley National Laboratory developed an open-source 3D simulation framework capable of modeling the atomistic origins of negative capacitance in ferroelectric thin films at the device level. When a material has negative capacitance, it can store a greater amount of electrical charge at lower voltages. The team believes the FerroX fra... » read more

Research Bits: Aug. 20
By Jesse Allen - 20 Aug, 2024 - Comments: 0

EUV mirror interference lithography Researchers from the Paul Scherrer Institute developed an EUV lithography technique that can produce conductive tracks with a separation of just five nanometers by exposing the sample indirectly rather than directly. Called EUV mirror interference lithography (MIL), the technique uses two mutually coherent beams that are reflected onto the wafer by two id... » read more

Chip Industry Technical Paper Roundup: July 16
By Linda Christensen - 16 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=244 /] More ReadingTechnical Paper Library home   » read more

Programmable Quantum Emitter Formation In Si (Lawrence Berkeley National Lab., UC Berkeley)
By Technical Paper Link - 08 Jul, 2024 - Comments: 0

A technical paper titled “Programmable quantum emitter formation in silicon” was published by researchers at Lawrence Berkeley National Laboratory and University of California Berkeley. Abstract: "Silicon-based quantum emitters are candidates for large-scale qubit integration due to their single-photon emission properties and potential for spin-photon interfaces with long spin coherence t... » read more

Chip Industry Week In Review
By The SE Staff - 21 Jun, 2024 - Comments: 0

BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Research Bits: May 13
By Jesse Allen - 13 May, 2024 - Comments: 0

On-chip microcapacitors Scientists from Lawrence Berkeley National Laboratory and University of California Berkeley developed microcapacitors with ultrahigh energy and power density that could be used for on-chip energy storage. The microcapacitors were made with thin films of hafnium oxide (HfO2) and zirconium oxide (ZrO2) engineered to achieve a negative capacitance effect, which increase... » read more

Chip Industry Week In Review
By The SE Staff - 12 Apr, 2024 - Comments: 0

Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Chip Industry Technical Paper Roundup: March 26
By Linda Christensen - 26 Mar, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=209 /] Find last week's technical paper additions here. » read more

An Open Hardware Approach in Quantum Technology
By Technical Paper Link - 19 Mar, 2024 - Comments: 0

A technical paper titled "Open Hardware Solutions in Quantum Technology" was published by researchers at Unitary Fund, Qruise GmbH, Technical University of Valencia, Lawrence Berkeley National Laboratory, Fermi National Accelerator Laboratory, Sandia National Laboratories, and others. Abstract "Quantum technologies such as communications, computing, and sensing offer vast opportunities for ... » read more

Research Bits: Mar. 11
By Jesse Allen - 11 Mar, 2024 - Comments: 0

Ferroelectric nanosheets Engineers from the University of Sydney, RMIT University, University of New South Wales, and University of Technology Sydney created a liquid metal alloy of tin, zirconium, and hafnium. The alloy has a thin oxide layer crust that enables it to be used to harvest ultra-thin tin oxide nanosheets doped with hafnium zirconium oxide, which could then be 2D printed on a subs... » read more

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