tag: Lawrence Livermore National Laboratory

Manufacturing Bits: Feb. 25
By Mark LaPedus - 25 Feb, 2020 - Comments: 0

Diamond finFETs HRL Laboratories has made new and significant progress to develop diamond finFETs. HRL, a joint R&D venture between Boeing and General Motors, has developed a new ohmic regrowth technique for diamond FETs. This in turn could pave the way towards commercial diamond FETs. Applications include spacecraft, satellites and systems with extreme temperatures. Still in R&D, diamo... » read more

Manufacturing Bits: Feb. 10
By Mark LaPedus - 10 Feb, 2020 - Comments: 0

Accelerating and cooling muons Using a novel particle accelerator, a group for the first time have observed a phenomenon called muon ionization cooling–an event that could give researchers a better understanding of matter and the universe. Muons are obscure sub-atomic particles. This experiment could pave the way towards the development of new and powerful muon particle accelerators. Thes... » read more

Manufacturing Bits: Nov. 19
By Mark LaPedus - 19 Nov, 2019 - Comments: 0

World’s lightest foam Lawrence Livermore National Laboratory (LLNL) has developed what researchers say is the world’s lightest gold foam. LLNL has devised gold aerogel foam. The foam is light enough where it could be carried on the back of tiny insects. Applications for the technology include electronics, catalysis, sensors and energy conversion and storage. An aerogel is based on a ... » read more

Manufacturing Bits: Aug. 13
By Mark LaPedus - 13 Aug, 2019 - Comments: 0

Exascale supercomputers The Department of Energy’s National Nuclear Security Administration (DOE/NNSA) has signed a contract valued at $600 million with Cray to build NNSA’s first exascale supercomputer. The system, called El Capitan, is expected to be shipped in late 2022. El Capitan will be housed at Lawrence Livermore National Laboratory (LLNL), and will perform research to maintain ... » read more

Manufacturing Bits: July 10
By Mark LaPedus - 10 Jul, 2019 - Comments: 0

Semicon West It’s Semicon West time again. Here’s the first wave of announcements at the event: Applied Materials has unveiled a pair of tools aimed at accelerating the industry adoption for new memories. First, Applied rolled out the Endura Clover MRAM PVD system. The system is an integrated platform for MRAM devices. Second, the company introduced the Endura Impulse PVD platform for P... » read more

System Bits: June 25
By Jeff Dorsch - 25 Jun, 2019 - Comments: 0

Supercomputers around the world At last week’s International Supercomputing Conference in Frankfurt, Germany, the 53rd biannual list of the Top500 of the most powerful computing systems in the world was released. Broken out by countries of installation, China has 219 of the world’s 500 fastest supercomputers, compared with 116 in the United States. Ranking by percent of list flops, the ... » read more

Manufacturing Bits: Feb. 19
By Mark LaPedus - 19 Feb, 2019 - Comments: 0

Computed Axial Lithography Lawrence Livermore National Laboratory (LLNL) and the University of California at Berkeley have developed a 3D printing method to produce a new class of polymer parts. The technology, called Computed Axial Lithography (CAL), projects photons on a resin in a vial within a 3D printer. In total, researchers have demonstrated the ability to shine 1,440 different proje... » read more

Manufacturing Bits: Jan. 9
By Mark LaPedus - 09 Jan, 2018 - Comments: 0

Two-photon lithography Lawrence Livermore National Laboratory (LLNL) has extended the capabilities of a high-resolution 3D printing technique called two-photon lithography (TPL). TPL enables the development of 3D-printed objects. LLNL’s technology could enable 3D-printed embedded structures inside the body, such as stents, joint replacements or bone scaffolds. It could also one day be ... » read more

Manufacturing Bits: Dec. 5
By Mark LaPedus - 05 Dec, 2017 - Comments: 3

Intel vs. GlobalFoundries At the IEEE International Electron Devices Meeting (IEDM) this week, GlobalFoundries and Intel will square off and present papers on their new logic processes. Intel will present more details about its previously-announced 10nm finFET technology, while GlobalFoundries will discuss its 7nm finFET process. As expected, Intel and GlobalFoundries will use 193nm immersi... » read more

Manufacturing Bits: Nov. 7
By Mark LaPedus - 07 Nov, 2017 - Comments: 0

Making a superbeam Lawrence Livermore National Laboratory (LLNL) has combined several lasers to create what it calls a superbeam. The move represents a possible breakthrough in the arena. In theory, lasers can be combined. But the laser beams tend to pass through each other, thereby making a combined laser or a superbeam nearly impossible. With the help of plasma optics, however, LLNL ha... » read more

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