Manufacturing Bits: Nov. 19

By Mark LaPedus - 19 Nov, 2019 - Comments: 0

World’s lightest foam Lawrence Livermore National Laboratory (LLNL) has developed what researchers say is the world’s lightest gold foam. LLNL has devised gold aerogel foam. The foam is light enough where it could be carried on the back of tiny insects. Applications for the technology include electronics, catalysis, sensors and energy conversion and storage. An aerogel is based on a ... » read more

Manufacturing Bits: Aug. 13

By Mark LaPedus - 13 Aug, 2019 - Comments: 0

Exascale supercomputers The Department of Energy’s National Nuclear Security Administration (DOE/NNSA) has signed a contract valued at $600 million with Cray to build NNSA’s first exascale supercomputer. The system, called El Capitan, is expected to be shipped in late 2022. El Capitan will be housed at Lawrence Livermore National Laboratory (LLNL), and will perform research to maintain ... » read more

Manufacturing Bits: July 10

By Mark LaPedus - 10 Jul, 2019 - Comments: 0

Semicon West It’s Semicon West time again. Here’s the first wave of announcements at the event: Applied Materials has unveiled a pair of tools aimed at accelerating the industry adoption for new memories. First, Applied rolled out the Endura Clover MRAM PVD system. The system is an integrated platform for MRAM devices. Second, the company introduced the Endura Impulse PVD platform for P... » read more

System Bits: June 25

By Jeff Dorsch - 25 Jun, 2019 - Comments: 0

Supercomputers around the world At last week’s International Supercomputing Conference in Frankfurt, Germany, the 53rd biannual list of the Top500 of the most powerful computing systems in the world was released. Broken out by countries of installation, China has 219 of the world’s 500 fastest supercomputers, compared with 116 in the United States. Ranking by percent of list flops, the ... » read more

Manufacturing Bits: Feb. 19

By Mark LaPedus - 19 Feb, 2019 - Comments: 0

Computed Axial Lithography Lawrence Livermore National Laboratory (LLNL) and the University of California at Berkeley have developed a 3D printing method to produce a new class of polymer parts. The technology, called Computed Axial Lithography (CAL), projects photons on a resin in a vial within a 3D printer. In total, researchers have demonstrated the ability to shine 1,440 different proje... » read more

Manufacturing Bits: Jan. 9

By Mark LaPedus - 09 Jan, 2018 - Comments: 0

Two-photon lithography Lawrence Livermore National Laboratory (LLNL) has extended the capabilities of a high-resolution 3D printing technique called two-photon lithography (TPL). TPL enables the development of 3D-printed objects. LLNL’s technology could enable 3D-printed embedded structures inside the body, such as stents, joint replacements or bone scaffolds. It could also one day be ... » read more

Manufacturing Bits: Dec. 5

By Mark LaPedus - 05 Dec, 2017 - Comments: 3

Intel vs. GlobalFoundries At the IEEE International Electron Devices Meeting (IEDM) this week, GlobalFoundries and Intel will square off and present papers on their new logic processes. Intel will present more details about its previously-announced 10nm finFET technology, while GlobalFoundries will discuss its 7nm finFET process. As expected, Intel and GlobalFoundries will use 193nm immersi... » read more

Manufacturing Bits: Nov. 7

By Mark LaPedus - 07 Nov, 2017 - Comments: 0

Making a superbeam Lawrence Livermore National Laboratory (LLNL) has combined several lasers to create what it calls a superbeam. The move represents a possible breakthrough in the arena. In theory, lasers can be combined. But the laser beams tend to pass through each other, thereby making a combined laser or a superbeam nearly impossible. With the help of plasma optics, however, LLNL ha... » read more

The Rise Of Parallelism

By Ed Sperling - 27 Apr, 2017 - Comments: 1

Parallel computing is an idea whose time has finally come, but not for the obvious reasons. Parallelism is a computer science concept that is older Moore's Law. In fact, it first appeared in print in a 1958 IBM research memo, in which John Cocke, a mathematician, and Daniel Slotnick, a computer scientist, discussed parallelism in numerical calculations. That was followed eight years later by... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 01 Apr, 2016 - Comments: 0

Chipmakers Lawrence Livermore National Laboratory (LLNL) has purchased a brain-inspired supercomputing platform for deep learning developed by IBM Research. LLNL will receive a 16-chip TrueNorth system from IBM. A single TrueNorth processor from IBM consists of 5.4 billion transistors wired together to create an array of 1 million digital neurons. The chip is fabricated based on a 28nm LPP pro... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Lawrence Livermore National Laboratory