Chip Industry Week In Review

By The SE Staff - 01 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

Multiple Hurdles In The Race To 6G

By John Koon - 03 Aug, 2023 - Comments: 0

The rollout of 6G will open the door to significant changes and possibilities, but whether this technology lives up to the hype will require massive collaborative efforts, huge investments in infrastructure, and solving some problems for which there are no precedents. Multiple companies are already working on 6G technology, aiming for a maximum download speed of one terabit per second (Tb/s)... » read more

Week In Review: Auto, Security, Pervasive Computing

By Linda Christensen - 02 Sep, 2022 - Comments: 0

The great EV ramp EV-related developments are everywhere. California’s move to ban sales of new internal-combustion vehicles by 2035, and the U.S. government’s sweeping embrace of clean-energy, are in lockstep with recent moves by the auto industry and related supply chains, as well as cutting-edge research. One of the big breakthroughs is the ability to charge an EV in 10 minutes witho... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 30 Jul, 2021 - Comments: 0

Chipmakers Intel has outlined its new process technology roadmap with plans to regain the leadership position in the market. As part of the move, Intel has changed the way it designates the nodes, revealed its new gate-all-around (GAA) transistor, and disclosed a customer for the GAA technology--Qualcomm. And not to be outdone, Intel has broadened its packaging portfolio. Intel is changing ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 09 Apr, 2021 - Comments: 0

Government policy At one point, there was a school of thought that the Biden administration would relax the current tariffs and export controls in regards to China. So far, the Biden administration hasn’t changed any of the previous policies and is doubling down on those efforts. The Department of Commerce’s Bureau of Industry and Security (BIS) this week added seven Chinese supercomput... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 31 Dec, 2020 - Comments: 0

Chipmakers and OEMs Third Point, a hedge fund, released a letter, saying that Intel needs to explore its strategic alternatives. This includes the breakup of the chip giant. Obtained by Yahoo and others, the letter says Intel needs to decide “whether Intel should remain an integrated device manufacturer” and should divest certain failed acquisitions. Here’s another analysis of the sit... » read more

Week In Review: Design, Low Power

By Jesse Allen - 27 Nov, 2020 - Comments: 0

AI Mythic debuted its Analog Matrix Processor for edge AI applications such as smart home, AR/VR, drones, video surveillance, smart city, and industrial. The M1108 AMP combines 108 tiles made up of an array of flash cells and ADCs, a 32-bit RISC-V nano-processor, a SIMD vector engine, SRAM, and a high-throughput Network-on-Chip router. It uses 40nm technology and the company says typical power... » read more

Recovery In Flat-Panel Display Biz

By Mark LaPedus - 20 Aug, 2020 - Comments: 0

The flat-panel display market is starting to recover after a period of oversupply and lackluster growth, fueled by new technologies as well as more people working from home. The flat-panel display market is complex. Several different technologies are at play, such as liquid-crystal displays (LCDs) for TV screens and other products, as well as organic light-emitting diodes (OLEDs) for smartph... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 04 Oct, 2019 - Comments: 0

Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the Philippines. In addition, Nepes has also licensed Deca’s M-Series wafer-level packaging technology. This includes fan-in technology as well as wafer- and panel-level fan-out. It also includes an ad... » read more

Challenges Grow For 5G Packages And Modules

By Mark LaPedus - 18 Jul, 2019 - Comments: 0

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC packages and RF modules for 5G phones are more complex and expensive than today's devices, and that gap will grow significantly in the second phase of 5G. In addition, 5G devices will require an as... » read more

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Chip Industry Week In Review

Multiple Hurdles In The Race To 6G

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

Week In Review: Manufacturing, Test

Week In Review: Design, Low Power

Recovery In Flat-Panel Display Biz

Week In Review: Manufacturing, Test

Challenges Grow For 5G Packages And Modules

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