Chip Industry Week In Review

By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Chip Industry Week In Review

By The SE Staff - 23 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Chip Industry Technical Paper Roundup: Feb. 19

By Liz Allan - 19 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=199 /] More ReadingTechnical Paper Library home » read more

New Metasurface Architecture To Deliver Ultrafast Information Processing And Versatile Terahertz Sources

By Technical Paper Link - 15 Feb, 2024 - Comments: 0

A technical paper titled “Light-driven nanoscale vectorial currents” was published by researchers at Los Alamos National Laboratory, Menlo Systems, University of California Davis, Columbia University, Sandia National Laboratories, and Intellectual Ventures. Abstract: "Controlled charge flows are fundamental to many areas of science and technology, serving as carriers of energy and informa... » read more

A Method To Transform Everyday Materials Into Conductors For Use In Quantum Computers

By Technical Paper Link - 14 Feb, 2024 - Comments: 0

A technical paper titled “Controllable strain-driven topological phase transition and dominant surface-state transport in HfTe5” was published by researchers at University of California Irvine, Los Alamos National Laboratory, and University of Tennessee. Abstract: "The fine-tuning of topologically protected states in quantum materials holds great promise for novel electronic devices. Howe... » read more

Chip Industry Week In Review

By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Research Bits: August 29

By Jesse Allen - 29 Aug, 2023 - Comments: 0

Resistive switching with hafnium oxide Researchers from the University of Cambridge, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo used hafnium oxide to build a resistive switching memory device that processes data in a similar way as the synapses in the human brain. At the atomic level, hafnium oxide has no structure, with the hafni... » read more

Week In Review: Manufacturing, Test

By Karen Heyman - 25 Aug, 2023 - Comments: 0

Intel aims to quadruple capacity for its most advanced chip packaging services by 2025, including with a new facility in Malaysia, per Nikkei Asia. Huawei is building a collection of secret semiconductor fabrication facilities across China to let the company skirt U.S. sanctions, SIA warned in a presentation seen by Bloomberg. It’s acquired at least two existing plants and is building at l... » read more

Week In Review: Automotive, Security and Pervasive Computing

By Linda Christensen - 18 Aug, 2023 - Comments: 0

The AAA Foundation for Traffic Safety estimates that between 2021 and 2050, ADAS technologies currently available to U.S. will prevent "approximately 37 million crashes, 14 million injuries, and nearly 250,000 deaths, which would represent 16% of crashes and injuries, and 22% of deaths that would otherwise occur on U.S. roads without these technologies," according to a new report. Governmen... » read more

Chip Industry’s Technical Paper Roundup: July 5

By Liz Allan - 05 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

← Older posts

tag: Los Alamos National Laboratory

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: Feb. 19

New Metasurface Architecture To Deliver Ultrafast Information Processing And Versatile Terahertz Sources

A Method To Transform Everyday Materials Into Conductors For Use In Quantum Computers

Chip Industry Week In Review

Research Bits: August 29

Week In Review: Manufacturing, Test

Week In Review: Automotive, Security and Pervasive Computing

Chip Industry’s Technical Paper Roundup: July 5

Trending Articles