Could Liquid IP Lead To Better Chips? (Part 3)

By Brian Bailey - 09 Jan, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss the benefits that could come from making IP available as abstract blocks instead of RTL implementations with Mark Johnstone, technical director for Electronic Design Automation for [getentity id="22499" e_name="NXP"] Semiconductor; [getperson id="11489" p_name="Drew Wingard"], CTO at [getentity id="22605" e_name="Sonics"]; Bryan Bowyer, director of ... » read more

Noise At 7nm And Beyond

By Ed Sperling - 14 Dec, 2017 - Comments: 0

The digital and analog worlds always have been very different. Digital engineers see the world in terms of electrons and a well-defined set of numerical values. Their waves are discrete and squared off and their devices are often noisy when they turn on and off. Analog engineers think in terms of quiet, smooth waves, and they are very concerned about anything that can disrupt those waves, such ... » read more

Tech Talk: EM Crosstalk

By Ed Sperling - 14 Dec, 2017 - Comments: 0

Anand Raman, senior director at Helic, talks about the impact of electromagnetic interference on digital design at 10/7nm and beyond. Once confined to the analog space, noise is suddenly an issue at advanced nodes for all designs. At the root of the problem are smaller nodes, increased speed and higher levels of integration. https://youtu.be/hzZqK2lNJNQ » read more

Accounting For Power Earlier

By Ann Mutschler - 14 Dec, 2017 - Comments: 5

Concerns about power usage in an SoC are far from new, but the adoption of power management techniques still varies by company and by project. Leading semiconductor providers have made the necessary changes in tooling and methodology to account for [getkc id="106" kc_name="power awareness"] because they have to, but the rest of the industry hasn't necessarily caught up. “The companies t... » read more

The Return Of Body Biasing

By Ann Mutschler - 15 Nov, 2017 - Comments: 1

Body biasing is making a comeback across a wide swath of process nodes as designers wrestle with how to build mobile devices with more functionality and longer battery life. Consider an ultra-low-power IoT device with a wireless sensor, for example, which is meant to last for years without changing a battery. Body biasing can be used to create an ultra-low-leakage sleep state. “In that ... » read more

Lots Of Little Knobs For Power

By Ann Mutschler - 09 Nov, 2017 - Comments: 3

Dynamic power is becoming a much bigger worry at new nodes as more finFETs are packed on a die and wires shrink to the point where resistance and capacitance become first-order effects. Chipmakers began seeing dynamic power density issues with the first generation of [getkc id="185" kc_name="finFETs"]. While the 3D transistor structures reduced leakage current by providing better gate contro... » read more

Tech Talk: Pseudo SRAM

By Ed Sperling - 26 Oct, 2017 - Comments: 0

eSilicon's Kar Yee Tang explains how to improve performance at 10/7nm without affecting power and area. https://youtu.be/4LI1pBLxxS4 » read more

How To Build An IoT Chip (Part 2)

By Ed Sperling - 18 Oct, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss IoT chip design issues with Jeff Miller, product marketing manager for electronic design systems in the Deep Submicron Division of [getentity id="22017" e_name="Mentor, a Siemens Business"]; Mike Eftimakis, IoT product manager in [getentity id="22186" e_name="Arm"]'s Systems and Software Group; and John Tinson, vice president of sales at Sondrel Ltd... » read more

Finite State Machine Synthesis In Programmable Circuits

By Radek Nawrot - 28 Sep, 2017 - Comments: 0

Well, summer has been and gone; and for most of us it was a time to relax and reflect on our working practices. What can we do to achieve better results? And what can we do to break out of the routine of working on so many revisions? For me, one of my summer break ponderings was thinking back on a trick I learned while working with my colleagues at the Silesian University of Technology. C... » read more

Tech Talk: TCAM

By Ed Sperling - 28 Sep, 2017 - Comments: 0

Dennis Dudeck, IP solutions FAE at eSilicon, talks about how to save power and area with ternary content addressable memory. https://youtu.be/y1FhdoNdzOw » read more

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tag: low-power design

Could Liquid IP Lead To Better Chips? (Part 3)

Noise At 7nm And Beyond

Tech Talk: EM Crosstalk

Accounting For Power Earlier

The Return Of Body Biasing

Lots Of Little Knobs For Power

Tech Talk: Pseudo SRAM

How To Build An IoT Chip (Part 2)

Finite State Machine Synthesis In Programmable Circuits

Tech Talk: TCAM

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