Smartphones Dial Up New RF Processes

By Mark LaPedus - 24 Jan, 2013 - Comments: 0

By Mark LaPedus The rapid shift towards smartphones and tablets is driving the need for new and low-power chips at finer geometries. Today, the latest application processors, integrated basebands and other digital cell-phone chips are 28nm planar devices. And it won’t be long before OEMs incorporate 20nm planar and finFET devices in their systems as a means to reduce power and extend batt... » read more

The Wi Of CES

By Ed Sperling - 26 Jan, 2012 - Comments: 0

By Pallab Chatterjee There has already been quite a bit written about the tablets, TVs and ultrabooks that consumed most of the floor space at this year’s CES show in Las Vegas. There was an underlying technology that was brought out at the show to bind these together—wireless. As the proliferation of content consumption device continues, creating a connected network to get this media a... » read more

Thinking Differently About Power

By Ed Sperling - 12 Jan, 2012 - Comments: 0

By Ed Sperling Battery life and lower electricity bills are now marketing tools for makers of SoCs, the mobile devices they go into, and servers that power data centers. A smart phone battery that lasts through the day without a charge, even when the user is playing high-action games, is a lot more attractive than one lasting only a few hours. And a data center electricity bill that shows a sh... » read more

LTE Heightens Power-Consumption Concerns

By Ed Sperling - 11 Mar, 2010 - Comments: 0

By Ellen Konieczny The air interface dubbed Long Term Evolution (LTE) hails the coming of fourth-generation (4G) cellular communications, which will benefit from both increased capacity and speed. Among the lofty goals of 4G technology is the promise of users being able to widely access streaming media, such as mobile television and video, in real time. Before such capabilities can be made ava... » read more

Return Of The Femtocell

By Cheryl Ajluni - 19 Nov, 2009 - Comments: 0

By Cheryl Ajluni Nothing has been left unscathed in the current global economic downturn, and that includes femtocell deployments. It was just last year that femtocells were being proclaimed a 2009 “killer app,” along with LTE and WiMAX. But what was once viewed as the next great thing has instead faced a tough road with more than a few large-scale deployments by major mobile operators be... » read more

Achieving Successful LTE Design and Test

By Cheryl Ajluni - 22 Jan, 2009 - Comments: 0

By Cheryl Ajluni In spite of all of its hype, WiMAX is not the only standard causing a stir these days or being called a “killer app.” Another technology that has achieved this illustrious title is Long Term Evolution (LTE), the Third Generation Partnership Project’s (3GPP’s) air interface for wireless access. Granted, WiMAX does have the advantage of a head start in development, test... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer