Preparing For 5G

By Jeff Dorsch - 09 Aug, 2016 - Comments: 0

If you like 4G LTE, you’re going to love 5G. The next-generation wireless communications technology will offer faster data transmission speeds and lower latency, providing the processing power to drive augmented-reality and virtual-reality applications for mobile devices and dedicated headsets. There is a caveat, though. The world needs to develop a consensus on what the 5G spectrum wil... » read more

System Bits: March 22

By Ann Mutschler - 22 Mar, 2016 - Comments: 0

How nanocrystal structures self assemble Researchers at MIT and the Cornell High Energy Synchrotron Source (CHESS) have discovered some of the secrets to a long-hidden magic trick behind the self-assembly of nanocrystal structures, the understanding of which could be used to create more vivid display screens and optical sensory devices. The transformation of simple colloidal particles — b... » read more

Manufacturing Bits: March 8

By Mark LaPedus - 08 Mar, 2016 - Comments: 1

5G mmWave consortium Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. Carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Radio-frequency (RF... » read more

Power/Performance Bits: Dec. 23

By Ann Mutschler - 23 Dec, 2014 - Comments: 0

Glimpsing pathway of sunlight to electricity According to University of Oregon and Lund University researchers, four pulses of laser light on nanoparticle photocells in a University of Oregon spectroscopy experiment have opened a window on how captured sunlight can be converted into electricity. The work, which the researchers expect could inspire devices with improved efficiency in solar e... » read more

Manufacturing Bits: Aug. 12

By Ed Sperling - 12 Aug, 2014 - Comments: 0

Origami Robots It may sound like something out of the movie Transformers, but MIT and Harvard have created origami robots that be reconfigured using timed sequencing. The robots were built from laser-cut parts using five layers of materials. A layer of etched copper is embedded between two structural layers of paper, with outer layers made of a polymer that folds when heated, according to... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Lund University

Preparing For 5G

System Bits: March 22

Manufacturing Bits: March 8

Power/Performance Bits: Dec. 23

Manufacturing Bits: Aug. 12