Fan-Out And Packaging Challenges

By Mark LaPedus - 06 Oct, 2021 - Comments: 2

Semiconductor Engineering sat down to discuss various IC packaging technologies, wafer-level and panel-level approaches, and the need for new materials with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of globa... » read more

Optimizing AI Systems

By Ed Sperling - 29 Sep, 2021 - Comments: 0

Inserting AI and machine learning into chips adds a whole new dimension of complexity, and creates a variety of potential problems, including deadlocks, loss of performance, and difficulty in achieving closure on many fronts. Gajinder Panesar, fellow at Siemens EDA, talks with Semiconductor Engineering about what’s changed and how to optimize these new devices and systems by monitoring them f... » read more

Software-Hardware Co-Design Becomes Real

By Brian Bailey - 27 Sep, 2021 - Comments: 1

For the past 20 years, the industry has sought to deploy hardware/software co-design concepts. While it is making progress, software/hardware co-design appears to have a much brighter future. In order to understand the distinction between the two approaches, it is important to define some of the basics. Hardware/software co-design is essentially a bottom-up process, where hardware is deve... » read more

Microelectronics And The AI Revolution

By Frank Schirrmeister - 23 Sep, 2021 - Comments: 0

It is no secret that artificial intelligence and machine learning (AI/ML) are critical drivers for growth in electronics, and particularly, for semiconductors. The recent AI Hardware Summit showcased trends in AI/ML, both in enabling and using it in various application domains, including EDA. As part of the summit, Imec had organized a panel on “Advanced Microelectronics Technologies Driving ... » read more

Using ML In EDA

By Ed Sperling - 20 Sep, 2021 - Comments: 0

Machine learning is becoming essential for designing chips due to the growing volume of data stemming from increasing density and complexity. Nick Ni, director of product marketing for AI at Xilinx, examines why machine learning is gaining traction at advanced nodes, where it’s being used today and how it will be used in the future, how quality of results compare with and without ML, and what... » read more

Deploying Artificial Intelligence At The Edge

By Pushkar Apte - 16 Sep, 2021 - Comments: 0

By Pushkar Apte and Tom Salmon Rapid advances in artificial intelligence (AI) have made this technology important for many industries, including finance, energy, healthcare, and microelectronics. AI is driving a multi-trillion-dollar global market while helping to solve some tough societal problems such as tracking the current pandemic and predicting the severity of climate-driven events lik... » read more

Fabs Drive Deeper Into Machine Learning

By Anne Meixner - 07 Sep, 2021 - Comments: 0

Advanced machine learning is beginning to make inroads into yield enhancement methodology as fabs and equipment makers seek to identify defectivity patterns in wafer images with greater accuracy and speed. Each month a wafer fabrication factory produces tens of millions of wafer-level images from inspection, metrology, and test. Engineers must analyze that data to improve yield and to reject... » read more

How Dynamic Hardware Efficiently Solves The Neural Network Complexity Problem

By Sam Fuller - 02 Sep, 2021 - Comments: 0

Given the high computational requirements of neural network models, efficient execution is paramount. When performed trillions of times per second even the tiniest inefficiencies are multiplied into large inefficiencies at the chip and system level. Because AI models continue to expand in complexity and size as they are asked to become more human-like in their (artificial) intelligence, it is c... » read more

Why TinyML Is Such A Big Deal

By Bryon Moyer - 02 Sep, 2021 - Comments: 1

While machine-learning (ML) development activity most visibly focuses on high-power solutions in the cloud or medium-powered solutions at the edge, there is another collection of activity aimed at implementing machine learning on severely resource-constrained systems. Known as TinyML, it’s both a concept and an organization — and it has acquired significant momentum over the last year or... » read more

Stepping Up To Greater Security

By Neeraj Paliwal - 02 Sep, 2021 - Comments: 0

The stakes for security grow with each passing day. The value of our data, our devices, and our network infrastructure continually increases as does our dependence on these vital resources. Reports appear weekly, and often daily, that describe security vulnerabilities in deployments. There is a steady drumbeat of successful attacks on systems that were assumed to be protecting infrastructure, i... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: machine learning