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Debug And Traceability Of MCMs And Chiplets In The Manufacturing Test Process


Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming larger while silicon geometries continue to get smaller, there is an opportunity to combine even more functionality into a smaller form factor for the end product. Hence, new advancements in desig... » read more

NIWeek Test Talk


Semiconductor Engineering sat down with David Hall, Chief Marketer, Semiconductor, of National Instruments, and Mike Watts, NI’s Senior Solutions Marketer, Semiconductor Test, during NIWeek 2018 in Austin, Texas. “One of the opportunities for National Instruments is that over the last 10 years, we’ve seen larger semiconductor organizations change the way they do testing both for R&... » read more