A Semiconductor Approach To Desalination


By Bernard Murphy and Jim Hogan We’re not offering breaking news when we observe that the semiconductor industry is in flux. Major consolidations and lack of funding for startups point to an industry that, outside China, is maturing and seems to have lost the recipe for rapid growth. Apologists will argue that analog or MEMS or some other domains are still strong, but this misses the point... » read more

Déjà Vu For CMP Modeling?


One definition of design for manufacturing (DFM) is providing knowledge about the impact of the manufacturing process on a design layout to the designers, so they can use that information to improve the robustness, reliability, or yield of their design before tapeout. Essentially, DFM is about designers taking ownership of the full “lifecycle” of a design, and going beyond the required desi... » read more

Electronic Gas Concerns On The Rise


In the grand scheme of the semiconductor supply chain, electronic gases are something most engineers and scientists never think about. Behind the gleaming machinery and brightly labeled tubes, however, these gases allow wafers to be etched, kept at optimum temperatures, and prepared for the application of thin films. Electronic gases are remarkably well managed in high-volume fabs, which is ... » read more

Wanted: Integrated Approach To Hardware Design


By Tarun Amla Today’s electronic products have become so sophisticated and ubiquitous that we have come to expect that each new generation will address both our current and future needs. Years ago, the industry was hardware-centric and driven by “big iron” products. Capacity and functionality were thoroughly dependent upon increasingly complex hardware. Think of the movies of the 1950s w... » read more

Challenges And Opportunities for China in the Semiconductor Industry


By Allen Lu China’s new industry investment and government promotion policies represent major opportunities for China and global semiconductor companies. The global industry is closely watching the details of the policy and its implementation ─ both because of the resources China’s government has dedicated and the potential impact to the global semiconductor manufacturing supply chain. I... » read more

Which Process, Material, IP?


For years chipmakers have been demanding more choices. They've finally gotten what they wished for—so many possibilities, in fact, that engineering teams of all types are having trouble wading through them. And to make matters worse, some choices now come with unexpected and often unwanted caveats. At the most advanced nodes it's a given that being able to shrink features and double patter... » read more

Rethinking Manufacturing Models


The perennial uncertainty surrounding EUV lithography and complications stemming from the most advanced nodes are creating a domino effect across the semiconductor industry. Rather than stalling the market, though, which is what happened with the transition to 20nm, vendors now are accelerating their product rollouts and adjusting business plans to capitalize on those delays. That includes m... » read more

Surprises At SEMICON West


As companies such as TSMC and Intel spend less on capital expenditures this year, expectations for SEMICON West 2015 were pretty bleak. I thought I’d have fewer appointments and nothing to really write home about. Au contraire. Although traffic on the show floor was nothing compared to events like CES, there are three things that are driving growth and excitement at semiconductor equipment... » read more

Challenges For The IIoT


Unlike the [getkc id="76" comment="Internet of Things"], which is largely still a collection of connected devices that don't always play well together, the Industrial Internet of Things ([getkc id="78" kc_name="IIoT"]) already is in heavy use and growing across a number of markets well outside of the usual markets associated with semiconductors. A Morgan Stanley "blue paper" report issued la... » read more

Faster Time To Root Cause With Diagnosis-Driven Yield Analysis


ICs developed at advanced technology nodes of 65 nm and below exhibit an increased sensitivity to small manufacturing variations. New design-specific and feature-sensitive failure mechanisms are on the rise. Complex variability issues that involve interactions between process and layout features can mask systematic yield issues. Without improved yield analysis methods, time-to-volume is delayed... » read more

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