Low Latency Networks: RoCE Or iWARP?

By Todd Owens - 02 May, 2019 - Comments: 0

Today, Remote Direct Memory Access (RDMA) is primarily being utilized within high performance computing or cloud environments to reduce latency across the network. Enterprise customers will soon require low latency networking that RDMA offers so that they can address a variety of different applications, such as Oracle and SAP, and also implement software-defined storage using Windows Storage Sp... » read more

Secure Data Center Traffic

By Marvell - 01 May, 2019 - Comments: 0

With the increasing data security breaches, encrypting and protecting data-in-flight and data-at-rest in data centers has gained the highest priority for data center security. To address the challenges of securing the perimeter and within the data center from unlawful intercepts, protect data integrity and confidentiality, Cloud Data Centers are increasingly encrypting data within and across da... » read more

Spreading Intelligence From The Cloud To The Edge

By Kevin Fogarty and Ed Sperling - 04 Apr, 2019 - Comments: 0

The challenge of partitioning processing between the edge and the cloud is beginning to come into focus as chipmakers and systems companies wrestle with a massive and rapidly growing volume of data. There are widely different assessments of how much data this ultimately will include, but everyone agrees it is a very large number. Petabytes are simply rounding errors in this equation, and tha... » read more

Getting Data Centers Ready For Composable Infrastructure

By George Hervey - 04 Apr, 2019 - Comments: 0

The data center networking landscape is set to change dramatically. More adaptive and operationally efficient composable infrastructure will soon start to see significant uptake, supplanting the traditional inflexible, siloed data center arrangements of the past and ultimately leading to universal adoption. Composable infrastructure takes a modern software-defined approach to data center imp... » read more

Making Chip Packaging Simpler

By Ed Sperling and Mark LaPedus - 21 Mar, 2019 - Comments: 1

Packaging is emerging as one of the most critical elements in semiconductor design, but it's also proving difficult to master both technically and economically. The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing pr... » read more

Isambard Analysis of HPC-Optimized Arm Processors

By Arm - 13 Mar, 2019 - Comments: 0

Written by Simon McIntosh‐Smith, James Price, Tom Deakin, Andrei Poenaru (all from the High Performance Computing Research Group, Department of Computer Science, University of Bristol, Bristol, UK) In this paper, we present performance results from Isambard, the first production supercomputer to be based on Arm CPUs that have been optimized specifically for HPC. Isambard is the first Cray ... » read more

Domain Expertise Becoming Essential For Analytics

By Ed Sperling - 12 Mar, 2019 - Comments: 0

Sensors are being added into everything, from end devices to the equipment used to make those sensors, but the data being generated has limited or no value unless it's accompanied by domain expertise. There are two main problems. One is how and where to process the vast amount of data being generated. Chip and system architectures are being revamped to pre-process more of that data closer to... » read more

Making Things Simple With NVMe/TCP

By Nishant Lodha - 07 Mar, 2019 - Comments: 0

Whether it is the aesthetics of the iPhone or a work of art like Monet’s ‘Water Lillies’, simplicity is often a very attractive trait. I hear this resonate in everyday examples from my own life – with my boss at work, whose mantra is “make it simple,” and my wife of 15 years telling my teenage daughter “beauty lies in simplicity.” For the record, both of these statements general... » read more

Week in Review: Design, Low Power

By Susan Rambo - 08 Feb, 2019 - Comments: 0

The U.S. Department of Energy (DOE) has awarded $35 million for 12 projects involving ultra-efficient power management. Called Arpa-E, the program encouraged participants to use medium-voltage electricity in new ways with real-world applications, such as industry, transportation and the grid. The top two award winners were Eaton Corp. (Arden, NC) for its DC wide-bandgap static circuit breaker, ... » read more

Making Autonomous Vehicles Safer

By Kevin Fogarty - 10 Jan, 2019 - Comments: 2

While self-driving vehicles are beta-tested on some public roads in real traffic situations, the semiconductor and automotive industries are still getting a grip on how to test and verify that vehicle electronics systems work as expected. Testing can be high stakes, especially when done in public. Some of the predictions about how humans will interact with autonomous vehicles (AVs) on public... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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