Is Maskless Lithography Coming Into Its Own?


Lithographers have always faced tradeoffs between speed and flexibility. Steppers are very good at printing hundreds or thousands of identical features onto hundreds or thousands of wafers. They are not especially good at handling surfaces with significant topography, though. Nor is customization feasible. Every exposure uses the same reticle. Direct write e-beam lithography has long been us... » read more

Manufacturing Bits: March 3


Security lithography At the recent SPIE Advanced Lithography conference, Multibeam disclosed more details about its efforts to develop multi-beam direct-write lithography for chip security applications. David Lam, chief executive and chairman of Multibeam, described how multi-beam lithography can be used to help thwart IC counterfeiting and tampering in the market. This lithography technolo... » read more

Litho Options For Panel Fan-out


Several packaging houses are inching closer to production of panel-level fan-out packaging, a next-generation technology that promises to reduce the cost of today’s fan-out packages. In fact, ASE, Nepes, Samsung and others already have installed the equipment in their panel-level fan-out lines with production slated for 2018 or so. But behind the scenes, panel-level packaging houses contin... » read more