Chip Industry Week In Review

By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Research Bits: May 10

By Jesse Allen - 10 May, 2023 - Comments: 0

Growing 2D TMDs on chips Researchers from Massachusetts Institute of Technology (MIT), Oak Ridge National Laboratory, and Ericsson Research found a way to “grow” layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a fully fabricated silicon chip, a technique they say could enable denser integrations. The researchers focused on molybdenum disulfide, which is f... » read more

Chip Industry’s Technical Paper Roundup: Jan. 17

By Linda Christensen - 17 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library. [table id=74 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting li... » read more

Hardware Trojan Detection Case Study Based on 4 Different ICs Manufactured in Progressively Smaller CMOS Process Technologies

By Technical Paper Link - 11 Jan, 2023 - Comments: 0

A technical paper titled "Red Team vs. Blue Team: A Real-World Hardware Trojan Detection Case Study Across Four Modern CMOS Technology Generations" was published by researchers at Max Planck Institute for Security and Privacy, Université catholique de Louvain (Belgium), Ruhr University Bochum, and Bundeskriminalamt. "In this work, we aim to improve upon this state of the art by presenting a... » read more

Research Bits: Oct. 18

By Jesse Allen - 18 Oct, 2022 - Comments: 0

Modular AI chip Engineers at the Massachusetts Institute of Technology (MIT), Harvard University, Stanford University, Lawrence Berkeley National Laboratory, Korea Institute of Science and Technology, and Tsinghua University created a modular approach to building stackable, reconfigurable AI chips. The design comprises alternating layers of sensing and processing elements, along with LEDs t... » read more

On the Design and Misuse of Microcoded (Embedded) Processors — A Cautionary Note

By Technical Paper Link - 08 Sep, 2021 - Comments: 0

Abstract: "Today's microprocessors often rely on microcode updates to address issues such as security or functional patches. Unfortunately, microcode update flexibility opens up new attack vectors through malicious microcode alterations. Such attacks share many features with hardware Trojans and have similar devastating consequences for system security. However, due to microcode's opaq... » read more