Driving AI, ML To New Levels On MCUs


One of the most dramatic impacts of technology of late has been the implementation of artificial intelligence and machine learning on small edge devices, the likes of which are forming the backbone of the Internet of Things. At first, this happened through sheer engineering willpower and innovation. But as the drive towards a world of a trillion connected devices accelerates, we must find wa... » read more

Challenges In Making And Testing STT-MRAM


Several chipmakers are ramping up a next-generation memory type called STT-MRAM, but there are still an assortment of manufacturing and test challenges for current and future devices. STT-MRAM, or spin-transfer torque MRAM, is attractive and gaining steam because it combines the attributes of several conventional memory types in a single device. In the works for years, STT-MRAM features the ... » read more

FD-SOI At The Edge


Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

Top Tech Talks Of 2018


2018 shaped up to be a year of transition and inflection, sometimes in the same design. There were new opportunities in automotive, continued difficulties in scaling, and an explosion in AI and machine learning everywhere. Traffic numbers on stories give a snapshot of the most current trends, but with videos those trends are even more apparent because of the time invested in watching those v... » read more

Foundries Prepare For Battle At 22nm


After introducing new 22nm processes over the last year or two, foundries are gearing up the technology for production—and preparing for a showdown. GlobalFoundries, Intel, TSMC and UMC are developing and/or expanding their efforts at 22nm amid signs this node could generate substantial business for applications like automotive, IoT and wireless. But foundry customers face some tough choic... » read more

Embedded Flash Scaling Limits


Embedded nonvolatile flash memory has played a key role in chips for years, but the technology is beginning to face some scaling and cost roadblocks and it’s not clear what comes next. Embedded flash is used in several markets, such as automotive, consumer and industrial. But the automotive sector appears to be the most concerned about the future of the technology. Typically, a car incorpo... » read more

System-In-Package Vs. eNVM


The booming automotive and IoT markets are driving increasing demand for microcontrollers (MCUs). Recent forecasts project that the overall MCU compound annual growth rate (CAGR) will reach 4% over the next five years, and in particular the automotive MCU CAGR could reach close to 14%. Non-volatile memory (NVM) is a critical element of MCUs, as it is needed not only to store the code, but al... » read more

CMOS-Embedded STT-MRAM Arrays In 2xnm Nodes For GP-MCU Applications


Perpendicular Spin-Transfer Torque (STT) MRAM is a promising technology in terms of read/write speed, low power consumption and non-volatility, but there has not been a demonstration of high density manufacturability at small geometries. In this paper we present an unprecedented demonstration of a robust STT-MRAM technology designed in a 2x nm CMOS- embedded 40 Mb array. Key features are full a... » read more

A New Memory Contender?


Momentum is building for a new class of ferroelectric memories that could alter the next-generation memory landscape. Generally, ferroelectrics are associated with a memory type called ferroelectric RAMs (FRAMs). Rolled out by several vendors in the late 1990s, FRAMs are low-power, nonvolatile devices, but they are also limited to niche applications and unable to scale beyond 130nm. While... » read more

Foundry Challenges in 2018


The silicon foundry business is expected to see steady growth in 2018, but that growth will come with several challenges. On the leading edge, GlobalFoundries, Intel, Samsung and TSMC are migrating from the 16nm/14nm to the 10nm/7nm logic nodes. Intel already has encountered some difficulties, as the chip giant recently pushed out the volume ramp of its new 10nm process from the second half ... » read more

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