EDA Looks Beyond Chips

By Ed Sperling - 25 Apr, 2024 - Comments: 0

Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale multi-physics simulations with methodologies and tools that were developed for chips. Top EDA executives have been talking about expanding into adjacent markets for more than a decade, but the broader markets were largely closed to them. In fact, the only significant step in... » read more

Structural Integrity Of Chips

By Ed Sperling - 23 Nov, 2020 - Comments: 0

A new challenge is on the horizon, and it's one that could have some interesting consequences for chip design — structural integrity. Ever since the introduction of finFETs and 3D NAND, the lines have been blurring between electrical and mechanical engineering. After some initial reports of fins collapsing or breaking, and variable distances between layers, chipmakers figured out how to so... » read more

The Criticality Of The E/E Architecture

By Mentor, a Siemens Business - 04 Mar, 2020 - Comments: 0

Modern vehicles are highly sophisticated systems incorporating electrical, electronic, software and mechanical components. Mechanical systems are giving way to advanced software and electronic devices, driving automakers to innovate and differentiate their vehicles via the electric and electronic (E/E) architecture. Future architectures need to be scalable across vehicle platforms, flexible to ... » read more

One-On-One: Walid Abu-Hadba

By Ed Sperling - 11 Feb, 2015 - Comments: 0

Walid Abu-Hadba, chief product officer at [getentity id="22021" e_name="Ansys"] (and a former top executive at Microsoft), sat down with Semiconductor Engineering to talk about systems engineering and why the starting point is no longer the SoC. What follows are excerpts of that conversation. SE: How do you define system? Abu-Hadba: It's everything. It's the entire product and where the p... » read more

System Bits: Dec. 10

By Brian Bailey - 10 Dec, 2013 - Comments: 0

Lasers From Nano Wires A few weeks ago, Semiconductor Engineering published a special report about silicon photonics and concentrated on the integration of the laser onto the silicon surface. Growing III-V materials on silicon is problematic because of the lattice mismatch, but researchers at the Technische Universität München (TUM) may have found a way around that problem. Thread-like semic... » read more

tag: mechanical engineering

EDA Looks Beyond Chips

Structural Integrity Of Chips

The Criticality Of The E/E Architecture

One-On-One: Walid Abu-Hadba

System Bits: Dec. 10

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