The Cyber-Industrial Revolution

By Ed Sperling - 07 Dec, 2020 - Comments: 0

Semiconductors won't save the world, but they certainly will help. In fact, it's arguable whether any significant progress will be made on such issues as global warming or future medical breakthroughs without the aid of ICs. After decades of struggling just to get chips to work at each new process node, the semiconductor industry is moving into a new phase. Processing is now almost ubiquitou... » read more

Big Changes For eFPGAs

By Ed Sperling - 11 May, 2020 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks with Semiconductor Engineering about the state of embedded FPGAs, why this is easier for some companies than others, why this is important for adding flexibility into an ASIC, and what are the main applications for this technology. » read more

COVID-19 Pandemic Highlights Importance Of Remote Patient Monitoring Technologies

By Andrew Baker - 07 May, 2020 - Comments: 0

During a pandemic like COVID-19, healthcare resources in hard-hit areas are under extreme stress. As a result, patients with chronic conditions are having to postpone certain treatments. According to the U.S. Centers for Disease Control and Prevention (CDC), 6 in 10 American adults live with at least one chronic disease and 4 in 10 adults have two or more. Conditions such as heart disease, canc... » read more

More Multiply-Accumulate Operations Everywhere

By Ed Sperling - 02 Apr, 2020 - Comments: 1

Geoff Tate, CEO of Flex Logix, sat down with Semiconductor Engineering to talk about how to build programmable edge inferencing chips, embedded FPGAs, where the markets are developing for both, and how the picture will change over the next few years. SE: What do you have to think about when you're designing a programmable inferencing chip? Tate: With a traditional FPGA architecture you ha... » read more

Medical, Industrial & Aerospace IC Design Changes

By Ann Mutschler - 30 Mar, 2020 - Comments: 0

Medical, industrial and aerospace chips are becoming much more complex as more intelligence is added into these devices, forcing design teams to begin leveraging tools and methodologies that typically have been used only at the leading-edge nodes for commercial applications. But as with automotive, the needs of these systems are changing quickly. In addition to strict quality, safety and sec... » read more

Changes In AI SoCs

By Ed Sperling - 12 Feb, 2020 - Comments: 0

Kurt Shuler, vice president of marketing at ArterisIP, talks about the tradeoffs in AI SoCs, which range from power and performance to flexibility, depending on whether processing elements are highly specific or more general, and the need for more modeling of both hardware and software together. » read more

Determining What Really Needs To Be Secured In A Chip

By Ed Sperling - 20 Jan, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss what's needed to secure hardware and why many previous approaches have been unsuccessful, with Warren Savage, research scientist in the Applied Research Laboratory for Intelligence and Security at the University of Maryland; Neeraj Paliwal, vice president and general manager of Rambus Security; Luis Ancajas, marketing director for IoT security softw... » read more

Improving Test Pattern Compression With Tessent VersaPoint Test Point Technology

By Mentor, a Siemens Business - 09 Dec, 2019 - Comments: 0

Mission-critical applications within markets such as transportation and medical devices require higher overall manufacturing test quality, but that often means more test patterns, data volume, and longer test times. Embedded test compression helps, but using VersaPoint test point technology results in 46X compression ration over what is possible with Tessent TestKompress alone. To read more,... » read more

Test Moving Forward And Backward

By Ed Sperling - 11 Jun, 2019 - Comments: 0

Test, once considered an important but rather mundane way of separating good chips from the not-so-good and the total rejects, is taking on a whole new life. After decades of largely living in the shadows behind design and advancements in materials and lithography, test has quietly shifted into a much more critical and more public role. But it has taken several rather significant shifts acro... » read more

Safety-Critical Coverage

By Ed Sperling - 24 Apr, 2019 - Comments: 0

Dave Landoll, solutions architect at OneSpin Solutions, discusses verification in safety-critical designs, why it’s more of a challenge in automotive than in avionics, and why verification of these systems includes what the system should not be doing as well as what it should be doing. https://youtu.be/Ze3WwEARfx0 » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?